April 2025
Intel has introduced its second-generation Intel Artificial Intelligence-enhanced software for defined vehicles system on chip, considering it as the first multi-process node chiplet architecture in the automotive industry. At Intel’s debut at Auto Shanghai, the new SOC was launched. The SOC is designed to increase demand in connected vehicles, advanced AI capabilities, and intelligent cost efficiency, and provide automakers with performance. The company further declared its official partnership with the popular automotive innovators Black Sesame and ModelBest technologies. This partnership will help the company encourage it to expand its automotive ecosystem business and excel in innovation in AI-powered cockpits. The collaborative integration will provide advancement in assisting system solutions and utilize energy more effectively and efficiently in vehicle computing sources.
Intel’s second-generation SDV SOC is the first initiative to accelerate a multi-node chiplet architecture in the Automotive Industry. It stands a chance to tailor to compute and develop more enhanced graphic skills according to AI capabilities.
Vice President and General Manager of Intel Automotive, Jack Weast, explains its new AI-powered chipset, saying that Intel is determined to believe in developing and redefining the automotive compute system by creating a second-generation SDV SoC. The merged flexible chiplet technology, along with the promising whole vehicle approach, will boost demand. With the help of the partners, Intel will progress in certain required areas by solving real industry challenges. Further, Intel will put more effort into improving its energy efficiency level and enhancing AI-driven quality for a better experience. This will bring a change to the company, from the software-defined vehicle revolution to reality. The company is thrilled to contribute to the automotive industry with its new launch.
April 2025
April 2025
April 2025
April 2025