The global advanced packaging market size was USD 33.64 billion in 2023, calculated at USD 36.49 billion in 2024 and is projected to surpass around USD 82.51 billion by 2034, expanding at a CAGR of 8.5% from 2024 to 2034.
The global advanced packaging market size accounted for USD 36.49 billion in 2024 and is expected to be worth around USD 82.51 billion by 2034, at a CAGR of 8.5% from 2024 to 2034.
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The Asia Pacific advanced packaging market size was estimated at USD 21.87 billion in 2023 and is predicted to be worth around USD 53.63 billion by 2034, at a CAGR of 8.7% from 2024 to 2034.
Asia Pacific dominates the advanced packaging market contributing a market share of more than 65% in 2023 and is expected to grow at a CAGR of 8.3% during the forecast period. It is because of the presence of major market players in this region and rapid growth in demand for semiconductors across various industry verticals such as automotive, consumer electronics, aerospace, defense and many others and the Government heavy investments in building semiconductor manufacturing plants specially in the developing countries such as India, China and South Korea. All these factors drive the growth of the Advanced Packaging Market. For instance, On 29th September 2021, Taiwan Semiconductor Manufacturing Co (TSMC) announced that it is developing new advanced packaging facilities in northern Taiwan. This advanced packaging fab in Chunan will be engaged in developing system on integrated chips (SoIC) technology.
North America is also estimated to grow significantly over the forecast period owing to the development of several advanced packaging technologies such as copper hybrid bonding and wafer level packaging (WPL) and the increasing demand for IoT-connected devices, such as wearables are some of the attributes that is anticipated to drive the growth of the Advanced Packaging Market in this region. For instance, On 25th February 2021, Veeco Instruments Inc. announced plans to expand its manufacturing capabilities in San Jose, California in order to meet the increasing demand for the advanced laser annealing technology that benefits the world’s leading semiconductor technology companies. This new, SEMI-compliant facility will serve the company’s for the development and production of laser annealing and advanced packaging lithography systems for semiconductor applications.
The emergence in the advanced packaging technology has minimized the installation cost of ICs and enhances the output and efficiency of ICs and this factor is expected to drive the market growth. Also, with augmentation of IC in the automobiles, the demand for advanced packaging surged and this contributed positively towards the growth of the advanced packaging market. For instance, on 10th May 2021, Veeco Instruments Inc. announced that it has received an order for its AP300 Lithography System used in the production ramp of advanced packaging chips. This advanced packaging devices will be used to meet increasing demand for 5G system-on-a-chip, graphic processors (GPUs) and high performance computing applications. The AP300 systems were selected due to its industry-leading uptime and performance along with low ownership cost. This order indicates the fostering market demand for Veeco’s lithography systems.
With the development in packaging technology, the functional density of large system-on-chip solutions has increased and this fosters the market growth. Moreover, the continuous research and developmental activities are performed in order to develop new and innovative packaging solutions and this will accelerate the growth of the advanced packaging market. Also, the rising demand for improving the performance of the electronic devices is estimated to fuel the growth of advanced packaging market. For instance, on 30th March 2021, YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for life sciences, semiconductor advanced packaging and AR/VR applications announced that it has received a large volume purchase order for the VertaCur XP from Taiwan-based OSAT Powertech Technology, Inc. The systems, which will be utilized for flip chip and wafer-level-packaging in high volume manufacturing, and it is expected to be delivered in the first half of 2021 to address growing production demands.
Furthermore, the surge in miniaturization of devices is assisting the embedded die packaging market gain renewed demand. Also, the heavy Government investment in developing semiconductor manufacturing plants specially in the developing nations are estimated to fuel the growth of market.
| Report Highlights | Details |
| Growth Rate from 2024 to 2034 | CAGR of 8.5% |
| Market Size in 2023 | USD 33.64 Billion |
| Market Size in 2024 | USD 36.49 Billion |
| Market Size by 2034 | USD 82.51 Billion |
| Largest Market | Asia Pacific |
| Fastest Growing Market | North America |
| Base Year | 2023 |
| Forecast Period | 2024 to 2034 |
| Regions Covered | North America, Asia Pacific, Europe, Latin America, Middle East and Africa |
Based on the Type, the Advanced Packaging Market is divided into Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 5D/3D, Fan Out WLP and Others. In this segment, the Fan-out wafer-level packaging (FOWLP) product type segment is accounted for contributing a significant market share amounting in 2023 and is expected to grow significantly during the forecast period. It is because of the significant benefits it provides such as lower thermal resistance, substrate-less package and higher performance. For instance, In 11th January 2021, Veeco Instruments Inc. announced that National Chiao Tung University (NCTU), based in Hsinchu, Taiwan, has been selected Veeco to be an important partnerin its initiative to boost the Taiwan’s semiconductor production.
Based on the End-use, the Advanced Packaging Market is divided into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense and Others. In this segment, the consumer electronics is accounted for contributing a significant market share in 2023 and is expected to grow significantly during the forecast period owing to the increase in demand for consumer electronics products in the market such as mobile phones, laptops, air conditioners and many others. Also, the demand for miniaturization of the electronic devices will provide huge growth opportunities. All these factors positively impact the growth of the Advanced Packaging Market.
Segments Covered in the Report
By Type
By End-use
By Geography
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Advanced Packaging Market
5.1. COVID-19 Landscape: Advanced Packaging Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Advanced Packaging Market, By Product
8.1. Advanced Packaging Market, by Product Type, 2024-2034
8.1.1. Flip Chip CSP
8.1.1.1. Market Revenue and Forecast (2021-2034)
8.1.2. Flip-Chip Ball Grid Array
8.1.2.1. Market Revenue and Forecast (2021-2034)
8.1.3. Wafer Level CSP
8.1.3.1. Market Revenue and Forecast (2021-2034)
8.1.4. 5D/3D
8.1.4.1. Market Revenue and Forecast (2021-2034)
8.1.5. Fan Out WLP
8.1.5.1. Market Revenue and Forecast (2021-2034)
8.1.6. Others
8.1.6.1. Market Revenue and Forecast (2021-2034)
Chapter 9. Global Advanced Packaging Market, By End User
9.1. Advanced Packaging Market, by End User, 2024-2034
9.1.1. Consumer Electronics
9.1.1.1. Market Revenue and Forecast (2021-2034)
9.1.2. Automotive
9.1.2.1. Market Revenue and Forecast (2021-2034)
9.1.3. Industrial
9.1.3.1. Market Revenue and Forecast (2021-2034)
9.1.4. Healthcare
9.1.4.1. Market Revenue and Forecast (2021-2034)
9.1.5. Aerospace & Defense
9.1.5.1. Market Revenue and Forecast (2021-2034)
9.1.6. Others
9.1.6.1. Market Revenue and Forecast (2021-2034)
Chapter 10. Global Advanced Packaging Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Product (2021-2034)
10.1.2. Market Revenue and Forecast, by End User (2021-2034)
10.1.3. U.S.
10.1.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.1.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.1.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.3. UK
10.2.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.4. Germany
10.2.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.5. France
10.2.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.6.2. Market Revenue and Forecast, by End User (2021-2034)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.3. India
10.3.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.4. China
10.3.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.5. Japan
10.3.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.6.2. Market Revenue and Forecast, by End User (2021-2034)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.3. GCC
10.4.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.4. North Africa
10.4.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.5. South Africa
10.4.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.6.2. Market Revenue and Forecast, by End User (2021-2034)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.5.3. Brazil
10.5.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.5.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.5.4.2. Market Revenue and Forecast, by End User (2021-2034)
Chapter 11. Company Profiles
11.1. Amkor Technology Inc.
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. ASE Technology Holding Co. Ltd.
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. China Wafer Level CSP Co., Ltd.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. ChipMOS Technologies, Inc.
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. FlipChip International LLC
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. HANA Micron Inc.
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Jiangsu Changjiang Electronics Technology Co., Ltd.
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. King Yuan Electronics Corp. (KYEC)
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. Nepes Corporation
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. Powertech Technology, Inc.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
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