The global advanced packaging market size was USD 33.64 billion in 2023, calculated at USD 36.49 billion in 2024 and is projected to surpass around USD 82.51 billion by 2034, expanding at a CAGR of 8.5% from 2024 to 2034.
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Advanced Packaging Market
5.1. COVID-19 Landscape: Advanced Packaging Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Advanced Packaging Market, By Product
8.1. Advanced Packaging Market, by Product Type, 2024-2034
8.1.1. Flip Chip CSP
8.1.1.1. Market Revenue and Forecast (2021-2034)
8.1.2. Flip-Chip Ball Grid Array
8.1.2.1. Market Revenue and Forecast (2021-2034)
8.1.3. Wafer Level CSP
8.1.3.1. Market Revenue and Forecast (2021-2034)
8.1.4. 5D/3D
8.1.4.1. Market Revenue and Forecast (2021-2034)
8.1.5. Fan Out WLP
8.1.5.1. Market Revenue and Forecast (2021-2034)
8.1.6. Others
8.1.6.1. Market Revenue and Forecast (2021-2034)
Chapter 9. Global Advanced Packaging Market, By End User
9.1. Advanced Packaging Market, by End User, 2024-2034
9.1.1. Consumer Electronics
9.1.1.1. Market Revenue and Forecast (2021-2034)
9.1.2. Automotive
9.1.2.1. Market Revenue and Forecast (2021-2034)
9.1.3. Industrial
9.1.3.1. Market Revenue and Forecast (2021-2034)
9.1.4. Healthcare
9.1.4.1. Market Revenue and Forecast (2021-2034)
9.1.5. Aerospace & Defense
9.1.5.1. Market Revenue and Forecast (2021-2034)
9.1.6. Others
9.1.6.1. Market Revenue and Forecast (2021-2034)
Chapter 10. Global Advanced Packaging Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Product (2021-2034)
10.1.2. Market Revenue and Forecast, by End User (2021-2034)
10.1.3. U.S.
10.1.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.1.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.1.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.3. UK
10.2.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.4. Germany
10.2.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.5. France
10.2.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Forecast, by Product (2021-2034)
10.2.6.2. Market Revenue and Forecast, by End User (2021-2034)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.3. India
10.3.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.4. China
10.3.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.5. Japan
10.3.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Forecast, by Product (2021-2034)
10.3.6.2. Market Revenue and Forecast, by End User (2021-2034)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.3. GCC
10.4.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.4. North Africa
10.4.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.4.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.5. South Africa
10.4.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Forecast, by Product (2021-2034)
10.4.6.2. Market Revenue and Forecast, by End User (2021-2034)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Product (2021-2034)
10.5.2. Market Revenue and Forecast, by End User (2021-2034)
10.5.3. Brazil
10.5.3.1. Market Revenue and Forecast, by Product (2021-2034)
10.5.3.2. Market Revenue and Forecast, by End User (2021-2034)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Forecast, by Product (2021-2034)
10.5.4.2. Market Revenue and Forecast, by End User (2021-2034)
Chapter 11. Company Profiles
11.1. Amkor Technology Inc.
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. ASE Technology Holding Co. Ltd.
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. China Wafer Level CSP Co., Ltd.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. ChipMOS Technologies, Inc.
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. FlipChip International LLC
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. HANA Micron Inc.
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Jiangsu Changjiang Electronics Technology Co., Ltd.
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. King Yuan Electronics Corp. (KYEC)
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. Nepes Corporation
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. Powertech Technology, Inc.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
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