Passive and Interconnecting Electronic Components Market Size, Share, and Trends 2024 to 2034

The global passive and interconnecting electronic components market size is calculated at USD 206.06 billion in 2025 and is forecasted to reach around USD 331.26 billion by 2034, accelerating at a CAGR of 5.38% from 2025 to 2034. The Asia Pacific passive and interconnecting electronic components market size surpassed USD 98.91 billion in 2025 and is expanding at a CAGR of 5.49% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.

  • Last Updated : January 2025
  • Report Code : 1372
  • Category : Semiconductor and Electronic

Chapter 1.  Introduction

1.1.  Research Objective

1.2.  Scope of the Study

1.3.  Definition

Chapter 2.  Research Methodology

2.1.  Research Approach

2.2.  Data Sources

2.3.  Assumptions & Limitations

Chapter 3.  Executive Summary

3.1.  Market Snapshot

Chapter 4.  Market Variables and Scope

4.1.  Introduction

4.2.  Market Classification and Scope

4.3.  Industry Value Chain Analysis

4.3.1.    Raw Material Procurement Analysis

4.3.2.    Sales and Distribution Channel Analysis

4.3.3.    Downstream Buyer Analysis

Chapter 5.  COVID 19 Impact on Passive and Interconnecting Electronic Components Market

5.1.  COVID-19 Landscape: Passive and Interconnecting Electronic Components Industry Impact

5.2.  COVID 19 - Impact Assessment for the Industry

5.3.  COVID 19 Impact: Global Major Government Policy

5.4.  Market Trends and Opportunities in the COVID-19 Landscape

6.1.  Market Dynamics

6.1.1.    Market Drivers

6.1.2.    Market Restraints

6.1.3.    Market Opportunities

6.2.  Porter’s Five Forces Analysis

6.2.1.    Bargaining power of suppliers

6.2.2.    Bargaining power of buyers

6.2.3.    Threat of substitute

6.2.4.    Threat of new entrants

6.2.5.    Degree of competition

Chapter 7.  Competitive Landscape

7.1.1.    Company Market Share/Positioning Analysis

7.1.2.    Key Strategies Adopted by Players

7.1.3.    Vendor Landscape

7.1.3.1.  List of Suppliers

7.1.3.2.   List of Buyers

Chapter 8.  Global Passive and Interconnecting Electronic Components Market, By Component

8.1.  Passive and Interconnecting Electronic Components Market, by Component,

8.1.1.    Passive

8.1.1.1.  Market Revenue and Forecast

8.1.2.    Interconnecting

8.1.2.1.  Market Revenue and Forecast

Chapter 9.  Global Passive and Interconnecting Electronic Components Market, By Application

9.1.  Passive and Interconnecting Electronic Components Market, by Application,

9.1.1.  Consumer Electronics

9.1.1.1. Market Revenue and Forecast

9.1.2.    IT & Telecommunication

9.1.2.1. Market Revenue and Forecast

9.1.3.   Automotive

9.1.3.1. Market Revenue and Forecast

9.1.4.    Industrial

9.1.4.1.        Market Revenue and Forecast

9.1.5.    Aerospace & Defense

9.1.5.1.  Market Revenue and Forecast

9.1.6.    Healthcare

9.1.6.1.  Market Revenue and Forecast

9.1.7.    Others

9.1.7.1.  Market Revenue and Forecast

Chapter 10.      Global Passive and Interconnecting Electronic Components Market, Regional Estimates and Trend Forecast

10.1.        North America

10.1.1.  Market Revenue and Forecast, by Component

10.1.2.  Market Revenue and Forecast, by Application

10.1.3.  U.S.

10.1.3.1. Market Revenue and Forecast, by Component

10.1.3.2.Market Revenue and Forecast, by Application

10.1.4.  Rest of North America

10.1.4.1. Market Revenue and Forecast, by Component

10.1.4.2. Market Revenue and Forecast, by Application

10.2.   Europe

10.2.1.  Market Revenue and Forecast, by Component

10.2.2.  Market Revenue and Forecast, by Application

10.2.3.  UK

10.2.3.1. Market Revenue and Forecast, by Component

10.2.3.2. Market Revenue and Forecast, by Application

10.2.4.  Germany

10.2.4.1. Market Revenue and Forecast, by Component

10.2.4.2. Market Revenue and Forecast, by Application

10.2.5.  France

10.2.5.1. Market Revenue and Forecast, by Component

10.2.5.2.  Market Revenue and Forecast, by Application

10.2.6.  Rest of Europe

10.2.6.1. Market Revenue and Forecast, by Component

10.2.6.2. Market Revenue and Forecast, by Application

10.3.     APAC

10.3.1.  Market Revenue and Forecast, by Component

10.3.2.  Market Revenue and Forecast, by Application

10.3.3.  India

10.3.3.1. Market Revenue and Forecast, by Component

10.3.3.2.Market Revenue and Forecast, by Application

10.3.4.  China

10.3.4.1.  Market Revenue and Forecast, by Component

10.3.4.2.  Market Revenue and Forecast, by Application

10.3.5.  Japan

10.3.5.1.  Market Revenue and Forecast, by Component

10.3.5.2.  Market Revenue and Forecast, by Application

10.3.6.  Rest of APAC

10.3.6.1.  Market Revenue and Forecast, by Component

10.3.6.2.  Market Revenue and Forecast, by Application

10.4.     MEA

10.4.1.  Market Revenue and Forecast, by Component

10.4.2.  Market Revenue and Forecast, by Application

10.4.3.  GCC

10.4.3.1.      Market Revenue and Forecast, by Component

10.4.3.2.      Market Revenue and Forecast, by Application

10.4.4.  North Africa

10.4.4.1.  Market Revenue and Forecast, by Component

10.4.4.2.  Market Revenue and Forecast, by Application

10.4.5.  South Africa

10.4.5.1. Market Revenue and Forecast, by Component

10.4.5.2.  Market Revenue and Forecast, by Application

10.4.6.  Rest of MEA

10.4.6.1.  Market Revenue and Forecast, by Component

10.4.6.2.  Market Revenue and Forecast, by Application

10.5.        Latin America

10.5.1.  Market Revenue and Forecast, by Component

10.5.2.  Market Revenue and Forecast, by Application

10.5.3.  Brazil

10.5.3.1.  Market Revenue and Forecast, by Component

10.5.3.2.   Market Revenue and Forecast, by Application

10.5.4.  Rest of LATAM

10.5.4.1.  Market Revenue and Forecast, by Component

10.5.4.2.  Market Revenue and Forecast, by Application

Chapter 11.  Company Profiles

11.1.   AVX Corporation

11.1.1.  Company Overview

11.1.2.  Component Offerings

11.1.3.  Financial Performance

11.1.4.  Recent Initiatives

11.2.   Vishay Intertechnology, Inc

11.2.1.  Company Overview

11.2.2.  Component Offerings

11.2.3.  Financial Performance

11.2.4.  Recent Initiatives

11.3.   Mouser Electronics, Inc

11.3.1.  Company Overview

11.3.2.  Component Offerings

11.3.3.  Financial Performance

11.3.4.  Recent Initiatives

11.4. Manufacturing Co., Ltd.

11.4.1.  Company Overview

11.4.2.  Component Offerings

11.4.3.  Financial Performance

11.4.4.  Recent Initiatives

11.5.    TDK Corporation

11.5.1.  Company Overview

11.5.2.  Component Offerings

11.5.3.  Financial Performance

11.5.4.  Recent Initiatives

11.6.   Taiyo Yuden Co., Ltd.

11.6.1.  Company Overview

11.6.2.  Component Offerings

11.6.3.  Financial Performance

11.6.4.  Recent Initiatives

11.7.    Samsung Electro-Mechanics

11.7.1.  Company Overview

11.7.2.  Component Offerings

11.7.3.  Financial Performance

11.7.4.  Recent Initiatives

11.8.  Hosiden Corporation

11.8.1.  Company Overview

11.8.2.  Component Offerings

11.8.3.  Financial Performance

11.8.4.  Recent Initiatives

11.9.   Yageo Corporation

11.9.1.  Company Overview

11.9.2.  Component Offerings

11.9.3.  Financial Performance

11.9.4.  Recent Initiatives

11.10.   Nichicon Corporation

11.10.1.  Company Overview

11.10.2.  Component Offerings

11.10.3  Financial Performance

11.10.4. Recent Initiatives

Chapter 12.  Research Methodology

12.1.  Primary Research

12.2. Secondary Research

12.3.  Assumptions

Chapter 13.  Appendix

13.1. About Us

13.2. Glossary of Terms

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Frequently Asked Questions

The global passive and interconnecting electronic components market size was reached at USD 196.06 billion in 2024 and is projected to hit USD 331.26 billion by 2034.

The global passive and interconnecting electronic components market is projected to grow at a CAGR of 5.38% during the forecast period 2025 to 2034.

The surge in demand for smartphones, laptops, gaming consoles, and household appliances is likely to be the primary driver of market growth.

The major players in the passive and interconnecting electronic components market are AVX Corporation; Vishay Intertechnology, Inc.; Mouser Electronics, Inc.; Murata Manufacturing Co., Ltd.; TDK Corporation; Taiyo Yuden Co., Ltd.; Samsung Electro-Mechanics; Hosiden Corporation.; Yageo Corporation; Nichicon Corporation; Panasonic Corporation; Fujitsu Component Limited; Fenghua (HK) Electronics Ltd.; Rohm Co., Ltd.; United Chemi-Con; TE connectivity; and Molex Incorporated.

Asia Pacific contributing a revenue share of more than USD 9.11 billion in 2024.

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