The global microelectronics market size is accounted at USD 360.33 billion in 2025 and is forecasted to hit around USD 511.85 billion by 2034, representing a CAGR of 3.94% from 2025 to 2034. The North America market size was estimated at USD 107.82 billion in 2024 and is expanding at a CAGR of 3.95% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Microelectronics Industry Impact
5.2. COVID-19 - Impact Assessment for the Industry
5.3. COVID-19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Microelectronics Market, by Technology
8.1.1. Semiconductors Integrated Circuits
8.1.1.1. Market Revenue and Forecast
8.1.2. Transistors
8.1.2.1. Market Revenue and Forecast
8.1.3. Resistors
8.1.3.1. Market Revenue and Forecast
8.1.4. Capacitors
8.1.4.1. Market Revenue and Forecast
9.1. Microelectronics Market, by Product Type
9.1.1. Digital Integrated Circuits
9.1.1.1. Market Revenue and Forecast
9.1.2. Analog Integrated Circuits
9.1.2.1. Market Revenue and Forecast
9.1.3. Mixed-Signal Integrated Circuits
9.1.3.1. Market Revenue and Forecast
9.1.4. Memory Microprocessors
9.1.4.1. Market Revenue and Forecast
10.1. Microelectronics Market, by Application
10.1.1. Automotive
10.1.1.1. Market Revenue and Forecast
10.1.2. Consumer Electronics
10.1.2.1. Market Revenue and Forecast
10.1.3. Industrial
10.1.3.1. Market Revenue and Forecast
10.1.4. Healthcare
10.1.4.1. Market Revenue and Forecast
10.1.5. Aerospace
10.1.5.1. Market Revenue and Forecast
10.1.6. Defense
10.1.6.1. Market Revenue and Forecast
11.1. Microelectronics Market, by Fabrication Process
11.1.1. CMOS
11.1.1.1. Market Revenue and Forecast
11.1.2. FinFET
11.1.2.1. Market Revenue and Forecast
11.1.3. SOI
11.1.3.1. Market Revenue and Forecast
11.1.4. GaN
11.1.4.1. Market Revenue and Forecast
11.1.5. SiC
11.1.5.1. Market Revenue and Forecast
12.1. Microelectronics Market, by Packaging Technology
12.1.1. Ball Grid Array (BGA)
12.1.1.1. Market Revenue and Forecast
12.1.2. Quad Flat Package (QFP)
12.1.2.1. Market Revenue and Forecast
12.1.3. Small Outline Integrated Circuit (SOIC)
12.1.3.1. Market Revenue and Forecast
12.1.4. Ceramic Pin Grid Array (CPGA)
12.1.4.1. Market Revenue and Forecast
12.1.5. Chip-on-Board (COB)
12.1.5.1. Market Revenue and Forecast
13.1. North America
13.1.1. Market Revenue and Forecast, by Technology
13.1.2. Market Revenue and Forecast, by Product Type
13.1.3. Market Revenue and Forecast, by Application
13.1.4. Market Revenue and Forecast, by Fabrication Process
13.1.5. Market Revenue and Forecast, by Packaging Technology
13.1.6. U.S.
13.1.6.1. Market Revenue and Forecast, by Technology
13.1.6.2. Market Revenue and Forecast, by Product Type
13.1.6.3. Market Revenue and Forecast, by Application
13.1.6.4. Market Revenue and Forecast, by Fabrication Process
13.1.6.5. Market Revenue and Forecast, by Packaging Technology
13.1.7. Rest of North America
13.1.7.1. Market Revenue and Forecast, by Technology
13.1.7.2. Market Revenue and Forecast, by Product Type
13.1.7.3. Market Revenue and Forecast, by Application
13.1.7.4. Market Revenue and Forecast, by Fabrication Process
13.1.7.5. Market Revenue and Forecast, by Packaging Technology
13.2. Europe
13.2.1. Market Revenue and Forecast, by Technology
13.2.2. Market Revenue and Forecast, by Product Type
13.2.3. Market Revenue and Forecast, by Application
13.2.4. Market Revenue and Forecast, by Fabrication Process
13.2.5. Market Revenue and Forecast, by Packaging Technology
13.2.6. UK
13.2.6.1. Market Revenue and Forecast, by Technology
13.2.6.2. Market Revenue and Forecast, by Product Type
13.2.6.3. Market Revenue and Forecast, by Application
13.2.7. Market Revenue and Forecast, by Fabrication Process
13.2.8. Market Revenue and Forecast, by Packaging Technology
13.2.9. Germany
13.2.9.1. Market Revenue and Forecast, by Technology
13.2.9.2. Market Revenue and Forecast, by Product Type
13.2.9.3. Market Revenue and Forecast, by Application
13.2.10. Market Revenue and Forecast, by Fabrication Process
13.2.11. Market Revenue and Forecast, by Packaging Technology
13.2.12. France
13.2.12.1. Market Revenue and Forecast, by Technology
13.2.12.2. Market Revenue and Forecast, by Product Type
13.2.12.3. Market Revenue and Forecast, by Application
13.2.12.4. Market Revenue and Forecast, by Fabrication Process
13.2.13. Market Revenue and Forecast, by Packaging Technology
13.2.14. Rest of Europe
13.2.14.1. Market Revenue and Forecast, by Technology
13.2.14.2. Market Revenue and Forecast, by Product Type
13.2.14.3. Market Revenue and Forecast, by Application
13.2.14.4. Market Revenue and Forecast, by Fabrication Process
13.2.15. Market Revenue and Forecast, by Packaging Technology
13.3. APAC
13.3.1. Market Revenue and Forecast, by Technology
13.3.2. Market Revenue and Forecast, by Product Type
13.3.3. Market Revenue and Forecast, by Application
13.3.4. Market Revenue and Forecast, by Fabrication Process
13.3.5. Market Revenue and Forecast, by Packaging Technology
13.3.6. India
13.3.6.1. Market Revenue and Forecast, by Technology
13.3.6.2. Market Revenue and Forecast, by Product Type
13.3.6.3. Market Revenue and Forecast, by Application
13.3.6.4. Market Revenue and Forecast, by Fabrication Process
13.3.7. Market Revenue and Forecast, by Packaging Technology
13.3.8. China
13.3.8.1. Market Revenue and Forecast, by Technology
13.3.8.2. Market Revenue and Forecast, by Product Type
13.3.8.3. Market Revenue and Forecast, by Application
13.3.8.4. Market Revenue and Forecast, by Fabrication Process
13.3.9. Market Revenue and Forecast, by Packaging Technology
13.3.10. Japan
13.3.10.1. Market Revenue and Forecast, by Technology
13.3.10.2. Market Revenue and Forecast, by Product Type
13.3.10.3. Market Revenue and Forecast, by Application
13.3.10.4. Market Revenue and Forecast, by Fabrication Process
13.3.10.5. Market Revenue and Forecast, by Packaging Technology
13.3.11. Rest of APAC
13.3.11.1. Market Revenue and Forecast, by Technology
13.3.11.2. Market Revenue and Forecast, by Product Type
13.3.11.3. Market Revenue and Forecast, by Application
13.3.11.4. Market Revenue and Forecast, by Fabrication Process
13.3.11.5. Market Revenue and Forecast, by Packaging Technology
13.4. MEA
13.4.1. Market Revenue and Forecast, by Technology
13.4.2. Market Revenue and Forecast, by Product Type
13.4.3. Market Revenue and Forecast, by Application
13.4.4. Market Revenue and Forecast, by Fabrication Process
13.4.5. Market Revenue and Forecast, by Packaging Technology
13.4.6. GCC
13.4.6.1. Market Revenue and Forecast, by Technology
13.4.6.2. Market Revenue and Forecast, by Product Type
13.4.6.3. Market Revenue and Forecast, by Application
13.4.6.4. Market Revenue and Forecast, by Fabrication Process
13.4.7. Market Revenue and Forecast, by Packaging Technology
13.4.8. North Africa
13.4.8.1. Market Revenue and Forecast, by Technology
13.4.8.2. Market Revenue and Forecast, by Product Type
13.4.8.3. Market Revenue and Forecast, by Application
13.4.8.4. Market Revenue and Forecast, by Fabrication Process
13.4.9. Market Revenue and Forecast, by Packaging Technology
13.4.10. South Africa
13.4.10.1. Market Revenue and Forecast, by Technology
13.4.10.2. Market Revenue and Forecast, by Product Type
13.4.10.3. Market Revenue and Forecast, by Application
13.4.10.4. Market Revenue and Forecast, by Fabrication Process
13.4.10.5. Market Revenue and Forecast, by Packaging Technology
13.4.11. Rest of MEA
13.4.11.1. Market Revenue and Forecast, by Technology
13.4.11.2. Market Revenue and Forecast, by Product Type
13.4.11.3. Market Revenue and Forecast, by Application
13.4.11.4. Market Revenue and Forecast, by Fabrication Process
13.4.11.5. Market Revenue and Forecast, by Packaging Technology
13.5. Latin America
13.5.1. Market Revenue and Forecast, by Technology
13.5.2. Market Revenue and Forecast, by Product Type
13.5.3. Market Revenue and Forecast, by Application
13.5.4. Market Revenue and Forecast, by Fabrication Process
13.5.5. Market Revenue and Forecast, by Packaging Technology
13.5.6. Brazil
13.5.6.1. Market Revenue and Forecast, by Technology
13.5.6.2. Market Revenue and Forecast, by Product Type
13.5.6.3. Market Revenue and Forecast, by Application
13.5.6.4. Market Revenue and Forecast, by Fabrication Process
13.5.7. Market Revenue and Forecast, by Packaging Technology
13.5.8. Rest of LATAM
13.5.8.1. Market Revenue and Forecast, by Technology
13.5.8.2. Market Revenue and Forecast, by Product Type
13.5.8.3. Market Revenue and Forecast, by Application
13.5.8.4. Market Revenue and Forecast, by Fabrication Process
13.5.8.5. Market Revenue and Forecast, by Packaging Technology
14.1. Acuity Brands Inc.
14.1.1. Company Overview
14.1.2. Product Offerings
14.1.3. Financial Performance
14.1.4. Recent Initiatives
14.2. ADT Corporation
14.2.1. Company Overview
14.2.2. Product Offerings
14.2.3. Financial Performance
14.2.4. Recent Initiatives
14.3. Control4 Corporation
14.3.1. Company Overview
14.3.2. Product Offerings
14.3.3. Financial Performance
14.3.4. Recent Initiatives
14.4. Crestron Electronics Inc.
14.4.1. Company Overview
14.4.2. Product Offerings
14.4.3. Financial Performance
14.4.4. Recent Initiatives
14.5. Cisco Systems Inc.
14.5.1. Company Overview
14.5.2. Product Offerings
14.5.3. Financial Performance
14.5.4. Recent Initiatives
14.6. Honeywell International Inc.
14.6.1. Company Overview
14.6.2. Product Offerings
14.6.3. Financial Performance
14.6.4. Recent Initiatives
14.7. United Technologies Corporation
14.7.1. Company Overview
14.7.2. Product Offerings
14.7.3. Financial Performance
14.7.4. Recent Initiatives
14.8. Johnson Controls Inc.
14.8.1. Company Overview
14.8.2. Product Offerings
14.8.3. Financial Performance
14.8.4. Recent Initiatives
14.9. Ingersoll Rand PLC
14.9.1. Company Overview
14.9.2. Product Offerings
14.9.3. Financial Performance
14.9.4. Recent Initiatives
14.10. Schneider Electric SE
14.10.1. Company Overview
14.10.2. Product Offerings
14.10.3. Financial Performance
14.10.4. Recent Initiatives
15.1. Primary Research
15.2. Secondary Research
15.3. Assumptions
16.1. About Us
16.2. Glossary of Terms
For questions or customization requests, please reach out to us at sales@precedenceresearch.com
No cookie-cutter, only authentic analysis – take the 1st step to become a Precedence Research client
Report Description
Get a Sample