GaN Semiconductor Devices Market (By Product: GaN Radio Frequency Devices, Opto-semiconductors, Power Semiconductors; By Component: Transistor, Diode, Rectifier, Power IC, Others; By Wafer Size: 2-inch, 4-inch, 6-inch, 8-inch; By End Use: Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Industrial & Power, Information & Communication Technology, Others) - Global Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2023-2032
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on GaN Semiconductor Devices Market
5.1. COVID-19 Landscape: GaN Semiconductor Devices Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global GaN Semiconductor Devices Market, By Product
8.1. GaN Semiconductor Devices Market, by Product, 2023-2032
8.1.1. GaN Radio Frequency Devices
8.1.1.1. Market Revenue and Forecast (2021-2032)
8.1.2. Opto-semiconductors
8.1.2.1. Market Revenue and Forecast (2021-2032)
8.1.3. Power Semiconductors
8.1.3.1. Market Revenue and Forecast (2021-2032)
Chapter 9. Global GaN Semiconductor Devices Market, By Component
9.1. GaN Semiconductor Devices Market, by Component, 2023-2032
9.1.1. Transistor
9.1.1.1. Market Revenue and Forecast (2021-2032)
9.1.2. Diode
9.1.2.1. Market Revenue and Forecast (2021-2032)
9.1.3. Rectifier
9.1.3.1. Market Revenue and Forecast (2021-2032)
9.1.4. Power IC
9.1.4.1. Market Revenue and Forecast (2021-2032)
9.1.5. Others
9.1.5.1. Market Revenue and Forecast (2021-2032)
Chapter 10. Global GaN Semiconductor Devices Market, By Wafer Size
10.1. GaN Semiconductor Devices Market, by Wafer Size, 2023-2032
10.1.1. 2-inch
10.1.1.1. Market Revenue and Forecast (2021-2032)
10.1.2. 4-inch
10.1.2.1. Market Revenue and Forecast (2021-2032)
10.1.3. 6-inch
10.1.3.1. Market Revenue and Forecast (2021-2032)
10.1.4. 8-inch
10.1.4.1. Market Revenue and Forecast (2021-2032)
Chapter 11. Global GaN Semiconductor Devices Market, By End Use
11.1. GaN Semiconductor Devices Market, by End Use, 2023-2032
11.1.1. Automotive
11.1.1.1. Market Revenue and Forecast (2021-2032)
11.1.2. Consumer Electronics
11.1.2.1. Market Revenue and Forecast (2021-2032)
11.1.3. Defense & Aerospace
11.1.3.1. Market Revenue and Forecast (2021-2032)
11.1.4. Healthcare
11.1.4.1. Market Revenue and Forecast (2021-2032)
11.1.5. Industrial & Power
11.1.5.1. Market Revenue and Forecast (2021-2032)
11.1.6. Information & Communication Technology
11.1.6.1. Market Revenue and Forecast (2021-2032)
11.1.7. Others
11.1.7.1. Market Revenue and Forecast (2021-2032)
Chapter 12. Global GaN Semiconductor Devices Market, Regional Estimates and Trend Forecast
12.1. North America
12.1.1. Market Revenue and Forecast, by Product (2021-2032)
12.1.2. Market Revenue and Forecast, by Component (2021-2032)
12.1.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.1.4. Market Revenue and Forecast, by End Use (2021-2032)
12.1.5. U.S.
12.1.5.1. Market Revenue and Forecast, by Product (2021-2032)
12.1.5.2. Market Revenue and Forecast, by Component (2021-2032)
12.1.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.1.5.4. Market Revenue and Forecast, by End Use (2021-2032)
12.1.6. Rest of North America
12.1.6.1. Market Revenue and Forecast, by Product (2021-2032)
12.1.6.2. Market Revenue and Forecast, by Component (2021-2032)
12.1.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.1.6.4. Market Revenue and Forecast, by End Use (2021-2032)
12.2. Europe
12.2.1. Market Revenue and Forecast, by Product (2021-2032)
12.2.2. Market Revenue and Forecast, by Component (2021-2032)
12.2.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.2.4. Market Revenue and Forecast, by End Use (2021-2032)
12.2.5. UK
12.2.5.1. Market Revenue and Forecast, by Product (2021-2032)
12.2.5.2. Market Revenue and Forecast, by Component (2021-2032)
12.2.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.2.5.4. Market Revenue and Forecast, by End Use (2021-2032)
12.2.6. Germany
12.2.6.1. Market Revenue and Forecast, by Product (2021-2032)
12.2.6.2. Market Revenue and Forecast, by Component (2021-2032)
12.2.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.2.6.4. Market Revenue and Forecast, by End Use (2021-2032)
12.2.7. France
12.2.7.1. Market Revenue and Forecast, by Product (2021-2032)
12.2.7.2. Market Revenue and Forecast, by Component (2021-2032)
12.2.7.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.2.7.4. Market Revenue and Forecast, by End Use (2021-2032)
12.2.8. Rest of Europe
12.2.8.1. Market Revenue and Forecast, by Product (2021-2032)
12.2.8.2. Market Revenue and Forecast, by Component (2021-2032)
12.2.8.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.2.8.4. Market Revenue and Forecast, by End Use (2021-2032)
12.3. APAC
12.3.1. Market Revenue and Forecast, by Product (2021-2032)
12.3.2. Market Revenue and Forecast, by Component (2021-2032)
12.3.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.3.4. Market Revenue and Forecast, by End Use (2021-2032)
12.3.5. India
12.3.5.1. Market Revenue and Forecast, by Product (2021-2032)
12.3.5.2. Market Revenue and Forecast, by Component (2021-2032)
12.3.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.3.5.4. Market Revenue and Forecast, by End Use (2021-2032)
12.3.6. China
12.3.6.1. Market Revenue and Forecast, by Product (2021-2032)
12.3.6.2. Market Revenue and Forecast, by Component (2021-2032)
12.3.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.3.6.4. Market Revenue and Forecast, by End Use (2021-2032)
12.3.7. Japan
12.3.7.1. Market Revenue and Forecast, by Product (2021-2032)
12.3.7.2. Market Revenue and Forecast, by Component (2021-2032)
12.3.7.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.3.7.4. Market Revenue and Forecast, by End Use (2021-2032)
12.3.8. Rest of APAC
12.3.8.1. Market Revenue and Forecast, by Product (2021-2032)
12.3.8.2. Market Revenue and Forecast, by Component (2021-2032)
12.3.8.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.3.8.4. Market Revenue and Forecast, by End Use (2021-2032)
12.4. MEA
12.4.1. Market Revenue and Forecast, by Product (2021-2032)
12.4.2. Market Revenue and Forecast, by Component (2021-2032)
12.4.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.4.4. Market Revenue and Forecast, by End Use (2021-2032)
12.4.5. GCC
12.4.5.1. Market Revenue and Forecast, by Product (2021-2032)
12.4.5.2. Market Revenue and Forecast, by Component (2021-2032)
12.4.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.4.5.4. Market Revenue and Forecast, by End Use (2021-2032)
12.4.6. North Africa
12.4.6.1. Market Revenue and Forecast, by Product (2021-2032)
12.4.6.2. Market Revenue and Forecast, by Component (2021-2032)
12.4.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.4.6.4. Market Revenue and Forecast, by End Use (2021-2032)
12.4.7. South Africa
12.4.7.1. Market Revenue and Forecast, by Product (2021-2032)
12.4.7.2. Market Revenue and Forecast, by Component (2021-2032)
12.4.7.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.4.7.4. Market Revenue and Forecast, by End Use (2021-2032)
12.4.8. Rest of MEA
12.4.8.1. Market Revenue and Forecast, by Product (2021-2032)
12.4.8.2. Market Revenue and Forecast, by Component (2021-2032)
12.4.8.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.4.8.4. Market Revenue and Forecast, by End Use (2021-2032)
12.5. Latin America
12.5.1. Market Revenue and Forecast, by Product (2021-2032)
12.5.2. Market Revenue and Forecast, by Component (2021-2032)
12.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.5.4. Market Revenue and Forecast, by End Use (2021-2032)
12.5.5. Brazil
12.5.5.1. Market Revenue and Forecast, by Product (2021-2032)
12.5.5.2. Market Revenue and Forecast, by Component (2021-2032)
12.5.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.5.5.4. Market Revenue and Forecast, by End Use (2021-2032)
12.5.6. Rest of LATAM
12.5.6.1. Market Revenue and Forecast, by Product (2021-2032)
12.5.6.2. Market Revenue and Forecast, by Component (2021-2032)
12.5.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)
12.5.6.4. Market Revenue and Forecast, by End Use (2021-2032)
Chapter 13. Company Profiles
13.1. Cree, Inc.
13.1.1. Company Overview
13.1.2. Product Offerings
13.1.3. Financial Performance
13.1.4. Recent Initiatives
13.2. Efficient Power Conversion Corporation
13.2.1. Company Overview
13.2.2. Product Offerings
13.2.3. Financial Performance
13.2.4. Recent Initiatives
13.3. Fujitsu Ltd.
13.3.1. Company Overview
13.3.2. Product Offerings
13.3.3. Financial Performance
13.3.4. Recent Initiatives
13.4. GaN Systems
13.4.1. Company Overview
13.4.2. Product Offerings
13.4.3. Financial Performance
13.4.4. Recent Initiatives
13.5. Infineon Technologies AG
13.5.1. Company Overview
13.5.2. Product Offerings
13.5.3. Financial Performance
13.5.4. Recent Initiatives
13.6. NexgenPowerSystems
13.6.1. Company Overview
13.6.2. Product Offerings
13.6.3. Financial Performance
13.6.4. Recent Initiatives
13.7. NXP Semiconductor
13.7.1. Company Overview
13.7.2. Product Offerings
13.7.3. Financial Performance
13.7.4. Recent Initiatives
13.8. Qorvo, Inc.
13.8.1. Company Overview
13.8.2. Product Offerings
13.8.3. Financial Performance
13.8.4. Recent Initiatives
13.9. Texas Instruments Incorporated
13.9.1. Company Overview
13.9.2. Product Offerings
13.9.3. Financial Performance
13.9.4. Recent Initiatives
13.10. Toshiba Corporation
13.10.1. Company Overview
13.10.2. Product Offerings
13.10.3. Financial Performance
13.10.4. Recent Initiatives
Chapter 14. Research Methodology
14.1. Primary Research
14.2. Secondary Research
14.3. Assumptions
Chapter 15. Appendix
15.1. About Us
15.2. Glossary of Terms
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