The global semiconductor packaging market size accounted for USD 49.88 billion in 2024, grew to USD 55.02 billion in 2025 and is projected to surpass around USD 132.95 billion by 2034, representing a healthy CAGR of 10.30% between 2024 and 2034. The Asia Pacific semiconductor packaging market size is worth around USD 23.94 billion in 2024 and is expected to grow at a fastest CAGR of 10.41% during the forecast period.
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Semiconductor Packaging Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Semiconductor Packaging Market Revenue and Volume Forecast, by Type, 2024-2034
8.1.1. Flip Chip
8.1.1.1. Market Revenue and Volume Forecast (2021-2034)
8.1.2. Embedded Die
8.1.2.1. Market Revenue and Volume Forecast (2021-2034)
8.1.3. Fan-in Wafer Level Packaging (FI-WLP)
8.1.3.1. Market Revenue and Volume Forecast (2021-2034)
8.1.4. Fan-out Wafer Level Packaging (FO-WLP)
8.1.4.1. Market Revenue and Volume Forecast (2021-2034)
9.1. Semiconductor Packaging Market Revenue and Volume Forecast, by Packaging Material, 2024-2034
9.1.1. Organic Substrate
9.1.1.1. Market Revenue and Volume Forecast (2021-2034)
9.1.2. Leadframe
9.1.2.1. Market Revenue and Volume Forecast (2021-2034)
9.1.3. Bonding Wire
9.1.3.1. Market Revenue and Volume Forecast (2021-2034)
9.1.4. Ceramic Package
9.1.4.1. Market Revenue and Volume Forecast (2021-2034)
9.1.5. Die Attach Material
9.1.5.1. Market Revenue and Volume Forecast (2021-2034)
10.1. Semiconductor Packaging Market Revenue and Volume Forecast, by Technology, 2024-2034
10.1.1. Grid Array
10.1.1.1. Market Revenue and Volume Forecast (2021-2034)
10.1.2. Small Outline Package
10.1.2.1. Market Revenue and Volume Forecast (2021-2034)
10.1.3. Flat- No Lead Package
10.1.3.1. Market Revenue and Volume Forecast (2021-2034)
10.1.4. Dual In- Line Package
10.1.4.1. Market Revenue and Volume Forecast (2021-2034)
10.1.5. Ceramic Dual In- Line Package
10.1.5.1. Market Revenue and Volume Forecast (2021-2034)
11.1. Semiconductor Packaging Market Revenue and Volume Forecast, by End-User, 2024-2034
11.1.1. Consumer Electronics
11.1.1.1. Market Revenue and Volume Forecast (2021-2034)
11.1.2. Communications and Telecom
11.1.2.1. Market Revenue and Volume Forecast (2021-2034)
11.1.3. Automotive Industry
11.1.3.1. Market Revenue and Volume Forecast (2021-2034)
11.1.4. Aerospace and Defense
11.1.4.1. Market Revenue and Volume Forecast (2021-2034)
11.1.5. Medical Devices
11.1.5.1. Market Revenue and Volume Forecast (2021-2034)
11.1.6. Energy and Lighting
11.1.6.1. Market Revenue and Volume Forecast (2021-2034)
12.1. North America
12.1.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.1.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.1.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.1.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.1.5. U.S.
12.1.5.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.1.5.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.1.5.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.1.5.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.1.6. Rest of North America
12.1.6.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.1.6.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.1.6.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.1.6.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.2. Europe
12.2.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.2.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.2.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.2.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.2.5. UK
12.2.5.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.2.5.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.2.5.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.2.5.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.2.6. Germany
12.2.6.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.2.6.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.2.6.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.2.6.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.2.7. France
12.2.7.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.2.7.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.2.7.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.2.7.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.2.8. Rest of Europe
12.2.8.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.2.8.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.2.8.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.2.8.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.3. APAC
12.3.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.3.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.3.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.3.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.3.5. India
12.3.5.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.3.5.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.3.5.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.3.5.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.3.6. China
12.3.6.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.3.6.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.3.6.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.3.6.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.3.7. Japan
12.3.7.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.3.7.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.3.7.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.3.7.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.3.8. Rest of APAC
12.3.8.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.3.8.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.3.8.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.3.8.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.4. MEA
12.4.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.4.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.4.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.4.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.4.5. GCC
12.4.5.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.4.5.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.4.5.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.4.5.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.4.6. North Africa
12.4.6.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.4.6.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.4.6.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.4.6.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.4.7. South Africa
12.4.7.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.4.7.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.4.7.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.4.7.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.4.8. Rest of MEA
12.4.8.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.4.8.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.4.8.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.4.8.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.5. Latin America
12.5.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.5.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.5.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.5.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.5.5. Brazil
12.5.5.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.5.5.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.5.5.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.5.5.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
12.5.6. Rest of LATAM
12.5.6.1. Market Revenue and Volume Forecast, by Type (2021-2034)
12.5.6.2. Market Revenue and Volume Forecast, by Packaging Material (2021-2034)
12.5.6.3. Market Revenue and Volume Forecast, by Technology (2021-2034)
12.5.6.4. Market Revenue and Volume Forecast, by End-User (2021-2034)
13.1. Amkor Technology
13.1.1. Company Overview
13.1.2. Product Offerings
13.1.3. Financial Performance
13.1.4. Recent Initiatives
13.2. Powertech Technology Inc.
13.2.1. Company Overview
13.2.2. Product Offerings
13.2.3. Financial Performance
13.2.4. Recent Initiatives
13.3. Intel Corporation
13.3.1. Company Overview
13.3.2. Product Offerings
13.3.3. Financial Performance
13.3.4. Recent Initiatives
13.4. ASE Group
13.4.1. Company Overview
13.4.2. Product Offerings
13.4.3. Financial Performance
13.4.4. Recent Initiatives
13.5. Jiangsu Changjiang Electronics Technology Co. LTD
13.5.1. Company Overview
13.5.2. Product Offerings
13.5.3. Financial Performance
13.5.4. Recent Initiatives
13.6. Samsung Electronics Co. Ltd.
13.6.1. Company Overview
13.6.2. Product Offerings
13.6.3. Financial Performance
13.6.4. Recent Initiatives
13.7. ChipMOS Technologies Inc.
13.7.1. Company Overview
13.7.2. Product Offerings
13.7.3. Financial Performance
13.7.4. Recent Initiatives
13.8. Taiwan Semiconductor Manufacturing Company
13.8.1. Company Overview
13.8.2. Product Offerings
13.8.3. Financial Performance
13.8.4. Recent Initiatives
13.9. Texas Instruments
13.9.1. Company Overview
13.9.2. Product Offerings
13.9.3. Financial Performance
13.9.4. Recent Initiatives
13.10. Fujitsu Limited
13.10.1. Company Overview
13.10.2. Product Offerings
13.10.3. Financial Performance
13.10.4. Recent Initiatives
14.1. Primary Research
14.2. Secondary Research
14.3. Assumptions
15.1. About Us
15.2. Glossary of Terms
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