Microchips Market Size, Share, and Trends 2024 to 2034

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology (Premium Insights)

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis 

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Microchips Market 

5.1. COVID-19 Landscape: Microchips Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Microchips Market, By Product Type

8.1. Microchips Market Revenue and Volume, by Product Type, 2024-2034

8.1.1. Integrated Device

8.1.1.1. Market Revenue and Volume Forecast (2021-2034)

8.1.2. Fabless

8.1.2.1. Market Revenue and Volume Forecast (2021-2034)

8.1.3. Foundry

8.1.3.1. Market Revenue and Volume Forecast (2021-2034)

8.1.4. Memory

8.1.4.1. Market Revenue and Volume Forecast (2021-2034)

8.1.5. Analog

8.1.5.1. Market Revenue and Volume Forecast (2021-2034)

8.1.6. Logic

8.1.6.1. Market Revenue and Volume Forecast (2021-2034)

8.1.7. Microcontroller

8.1.7.1. Market Revenue and Volume Forecast (2021-2034)

Chapter 9. Global Microchips Market, By Substrate Material

9.1. Microchips Market Revenue and Volume, by Substrate Material, 2024-2034

9.1.1. Silicon

9.1.1.1. Market Revenue and Volume Forecast (2021-2034)

9.1.2. Compound Semiconductor

9.1.2.1. Market Revenue and Volume Forecast (2021-2034)

Chapter 10. Global Microchips Market, By End-User 

10.1. Microchips Market Revenue and Volume, by End-User, 2024-2034

10.1.1. Consumer Electronics

10.1.1.1. Market Revenue and Volume Forecast (2021-2034)

10.1.2. Automotive

10.1.2.1. Market Revenue and Volume Forecast (2021-2034)

10.1.3. Healthcare

10.1.3.1. Market Revenue and Volume Forecast (2021-2034)

10.1.4. Military & Civil Aerospace

10.1.4.1. Market Revenue and Volume Forecast (2021-2034)

10.1.5. Industrial

10.1.5.1. Market Revenue and Volume Forecast (2021-2034)

10.1.6. Telecommunications

10.1.6.1. Market Revenue and Volume Forecast (2021-2034)

10.1.7. Data Processing

10.1.7.1. Market Revenue and Volume Forecast (2021-2034)

Chapter 11. Global Microchips Market, By Manufacturing Process

11.1. Microchips Market Revenue and Volume, by Manufacturing Process, 2024-2034

11.1.1. Planar

11.1.1.1. Market Revenue and Volume Forecast (2021-2034)

11.1.2. FinFET

11.1.2.1. Market Revenue and Volume Forecast (2021-2034)

11.1.3. FD-SOI

11.1.3.1. Market Revenue and Volume Forecast (2021-2034)

Chapter 12. Global Microchips Market, By Wafer Size

12.1. Microchips Market Revenue and Volume, by Wafer Size, 2024-2034

12.1.1. 6-inch

12.1.1.1. Market Revenue and Volume Forecast (2021-2034)

12.1.2. 8-inch

12.1.2.1. Market Revenue and Volume Forecast (2021-2034)

12.1.3. 12-inch

12.1.3.1. Market Revenue and Volume Forecast (2021-2034)

12.1.4. 18-inch

12.1.4.1. Market Revenue and Volume Forecast (2021-2034)

Chapter 13. Global Microchips Market, Regional Estimates and Trend Forecast

13.1. North America

13.1.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.1.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.1.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.1.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.1.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.1.6. U.S.

13.1.6.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.1.6.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.1.6.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.1.6.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.1.6.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034) 

13.1.7. Rest of North America

13.1.7.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.1.7.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.1.7.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.1.7.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.1.7.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.2. Europe

13.2.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.2.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.2.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.2.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034) 

13.2.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034) 

13.2.6. UK

13.2.6.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.2.6.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.2.6.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.2.7. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034) 

13.2.8. Market Revenue and Volume Forecast, by Wafer Size (2021-2034) 

13.2.9. Germany

13.2.9.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.2.9.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.2.9.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.2.10. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.2.11. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.2.12. France

13.2.12.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.2.12.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.2.12.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.2.12.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.2.13. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.2.14. Rest of Europe

13.2.14.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.2.14.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.2.14.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.2.14.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.2.15. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.3. APAC

13.3.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.3.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.3.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.3.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.3.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.3.6. India

13.3.6.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.3.6.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.3.6.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.3.6.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.3.7. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.3.8. China

13.3.8.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.3.8.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.3.8.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.3.8.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.3.9. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.3.10. Japan

13.3.10.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.3.10.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.3.10.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.3.10.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.3.10.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.3.11. Rest of APAC

13.3.11.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.3.11.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.3.11.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.3.11.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.3.11.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.4. MEA

13.4.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.4.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.4.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.4.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.4.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.4.6. GCC

13.4.6.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.4.6.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.4.6.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.4.6.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.4.7. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.4.8. North Africa

13.4.8.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.4.8.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.4.8.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.4.8.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.4.9. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.4.10. South Africa

13.4.10.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.4.10.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.4.10.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.4.10.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.4.10.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.4.11. Rest of MEA

13.4.11.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.4.11.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.4.11.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.4.11.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.4.11.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.5. Latin America

13.5.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.5.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.5.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.5.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.5.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.5.6. Brazil

13.5.6.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.5.6.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.5.6.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.5.6.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.5.7. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

13.5.8. Rest of LATAM

13.5.8.1. Market Revenue and Volume Forecast, by Product Type (2021-2034)

13.5.8.2. Market Revenue and Volume Forecast, by Substrate Material (2021-2034)

13.5.8.3. Market Revenue and Volume Forecast, by End-User (2021-2034)

13.5.8.4. Market Revenue and Volume Forecast, by Manufacturing Process (2021-2034)

13.5.8.5. Market Revenue and Volume Forecast, by Wafer Size (2021-2034)

Chapter 14. Company Profiles

14.1. Intel Corporation

14.1.1. Company Overview

14.1.2. Product Offerings

14.1.3. Financial Performance

14.1.4. Recent Initiatives

14.2. Samsung Electronics Co., Ltd.

14.2.1. Company Overview

14.2.2. Product Offerings

14.2.3. Financial Performance

14.2.4. Recent Initiatives

14.3. Taiwan Semiconductor Manufacturing Company Limited (TSMC)

14.3.1. Company Overview

14.3.2. Product Offerings

14.3.3. Financial Performance

14.3.4. Recent Initiatives

14.4. Qualcomm Incorporated

14.4.1. Company Overview

14.4.2. Product Offerings

14.4.3. Financial Performance

14.4.4. Recent Initiatives

14.5. NVIDIA Corporation

14.5.1. Company Overview

14.5.2. Product Offerings

14.5.3. Financial Performance

14.5.4. Recent Initiatives

14.6. Advanced Micro Devices, Inc. (AMD)

14.6.1. Company Overview

14.6.2. Product Offerings

14.6.3. Financial Performance

14.6.4. Recent Initiatives

14.7. Texas Instruments Incorporated

14.7.1. Company Overview

14.7.2. Product Offerings

14.7.3. Financial Performance

14.7.4. Recent Initiatives

14.8. Micron Technology, Inc.

14.8.1. Company Overview

14.8.2. Product Offerings

14.8.3. Financial Performance

14.8.4. Recent Initiatives

14.9. SK hynix Inc.

14.9.1. Company Overview

14.9.2. Product Offerings

14.9.3. Financial Performance

14.9.4. Recent Initiatives

14.10. Broadcom Inc.

14.10.1. Company Overview

14.10.2. Product Offerings

14.10.3. Financial Performance

14.10.4. Recent Initiatives

Chapter 15. Research Methodology

15.1. Primary Research

15.2. Secondary esearch

15.3. Assumptions

Chapter 16. Appendix

16.1. About Us

16.2. Glossary of Terms