Next Generation Memory Market Size, Share, and Trends 2024 to 2033

Next Generation Memory Market (By Technology: Non-volatile Memory, Volatile Memory; By Wafer Size: 200 mm, 300 mm; By Application: Consumer Electronics, Enterprise Storage, Automotive & Transportation, Military & Aerospace, Industrial, Telecommunications, Energy & Power, Healthcare, Agricultural) - Global Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2024-2033

  • Last Updated : February 2024
  • Report Code : 3747
  • Category : ICT

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology (Premium Insights)

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis 

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Next Generation Memory Market 

5.1. COVID-19 Landscape: Next Generation Memory Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Next Generation Memory Market, By Technology

8.1. Next Generation Memory Market, by Technology, 2024-2033

8.1.1 Non-volatile Memory

8.1.1.1. Market Revenue and Forecast (2021-2033)

8.1.2. Volatile Memory

8.1.2.1. Market Revenue and Forecast (2021-2033)

Chapter 9. Global Next Generation Memory Market, By Wafer Size

9.1. Next Generation Memory Market, by Wafer Size, 2024-2033

9.1.1. 200 mm

9.1.1.1. Market Revenue and Forecast (2021-2033)

9.1.2. 300 mm

9.1.2.1. Market Revenue and Forecast (2021-2033)

Chapter 10. Global Next Generation Memory Market, By Application 

10.1. Next Generation Memory Market, by Application, 2024-2033

10.1.1. Consumer Electronics

10.1.1.1. Market Revenue and Forecast (2021-2033)

10.1.2. Enterprise Storage

10.1.2.1. Market Revenue and Forecast (2021-2033)

10.1.3. Automotive & Transportation

10.1.3.1. Market Revenue and Forecast (2021-2033)

10.1.4. Military & Aerospace

10.1.4.1. Market Revenue and Forecast (2021-2033)

10.1.5. Industrial

10.1.5.1. Market Revenue and Forecast (2021-2033)

10.1.6. Telecommunications

10.1.6.1. Market Revenue and Forecast (2021-2033)

10.1.7. Energy & Power

10.1.7.1. Market Revenue and Forecast (2021-2033)

10.1.8. Healthcare

10.1.8.1. Market Revenue and Forecast (2021-2033)

10.1.9. Agricultural

10.1.9.1. Market Revenue and Forecast (2021-2033)

10.1.10. Retail

10.1.10.1. Market Revenue and Forecast (2021-2033)

10.1.11. Others

10.1.11.1. Market Revenue and Forecast (2021-2033)

Chapter 11. Global Next Generation Memory Market, Regional Estimates and Trend Forecast

11.1. North America

11.1.1. Market Revenue and Forecast, by Technology (2021-2033)

11.1.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.1.3. Market Revenue and Forecast, by Application (2021-2033)

11.1.4. U.S.

11.1.4.1. Market Revenue and Forecast, by Technology (2021-2033)

11.1.4.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.1.4.3. Market Revenue and Forecast, by Application (2021-2033)

11.1.5. Rest of North America

11.1.5.1. Market Revenue and Forecast, by Technology (2021-2033)

11.1.5.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.1.5.3. Market Revenue and Forecast, by Application (2021-2033)

11.2. Europe

11.2.1. Market Revenue and Forecast, by Technology (2021-2033)

11.2.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.2.3. Market Revenue and Forecast, by Application (2021-2033)

11.2.4. UK

11.2.4.1. Market Revenue and Forecast, by Technology (2021-2033)

11.2.4.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.2.4.3. Market Revenue and Forecast, by Application (2021-2033)

11.2.5. Germany

11.2.5.1. Market Revenue and Forecast, by Technology (2021-2033)

11.2.5.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.2.5.3. Market Revenue and Forecast, by Application (2021-2033)

11.2.6. France

11.2.6.1. Market Revenue and Forecast, by Technology (2021-2033)

11.2.6.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.2.6.3. Market Revenue and Forecast, by Application (2021-2033)

11.2.7. Rest of Europe

11.2.7.1. Market Revenue and Forecast, by Technology (2021-2033)

11.2.7.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.2.7.3. Market Revenue and Forecast, by Application (2021-2033)

11.3. APAC

11.3.1. Market Revenue and Forecast, by Technology (2021-2033)

11.3.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.3.3. Market Revenue and Forecast, by Application (2021-2033)

11.3.4. India

11.3.4.1. Market Revenue and Forecast, by Technology (2021-2033)

11.3.4.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.3.4.3. Market Revenue and Forecast, by Application (2021-2033)

11.3.5. China

11.3.5.1. Market Revenue and Forecast, by Technology (2021-2033)

11.3.5.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.3.5.3. Market Revenue and Forecast, by Application (2021-2033)

11.3.6. Japan

11.3.6.1. Market Revenue and Forecast, by Technology (2021-2033)

11.3.6.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.3.6.3. Market Revenue and Forecast, by Application (2021-2033)

11.3.7. Rest of APAC

11.3.7.1. Market Revenue and Forecast, by Technology (2021-2033)

11.3.7.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.3.7.3. Market Revenue and Forecast, by Application (2021-2033)

11.4. MEA

11.4.1. Market Revenue and Forecast, by Technology (2021-2033)

11.4.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.4.3. Market Revenue and Forecast, by Application (2021-2033)

11.4.4. GCC

11.4.4.1. Market Revenue and Forecast, by Technology (2021-2033)

11.4.4.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.4.4.3. Market Revenue and Forecast, by Application (2021-2033)

11.4.5. North Africa

11.4.5.1. Market Revenue and Forecast, by Technology (2021-2033)

11.4.5.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.4.5.3. Market Revenue and Forecast, by Application (2021-2033)

11.4.6. South Africa

11.4.6.1. Market Revenue and Forecast, by Technology (2021-2033)

11.4.6.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.4.6.3. Market Revenue and Forecast, by Application (2021-2033)

11.4.7. Rest of MEA

11.4.7.1. Market Revenue and Forecast, by Technology (2021-2033)

11.4.7.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.4.7.3. Market Revenue and Forecast, by Application (2021-2033)

11.5. Latin America

11.5.1. Market Revenue and Forecast, by Technology (2021-2033)

11.5.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.5.3. Market Revenue and Forecast, by Application (2021-2033)

11.5.4. Brazil

11.5.4.1. Market Revenue and Forecast, by Technology (2021-2033)

11.5.4.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.5.4.3. Market Revenue and Forecast, by Application (2021-2033)

11.5.5. Rest of LATAM

11.5.5.1. Market Revenue and Forecast, by Technology (2021-2033)

11.5.5.2. Market Revenue and Forecast, by Wafer Size (2021-2033)

11.5.5.3. Market Revenue and Forecast, by Application (2021-2033)

Chapter 12. Company Profiles

12.1. Micron Technology, Inc. (United States)

12.1.1. Company Overview

12.1.2. Product Offerings

12.1.3. Financial Performance

12.1.4. Recent Initiatives

12.2. Samsung Electronics Co., Ltd. (South Korea)

12.2.1. Company Overview

12.2.2. Product Offerings

12.2.3. Financial Performance

12.2.4. Recent Initiatives

12.3. SK Hynix Inc. (South Korea)

12.3.1. Company Overview

12.3.2. Product Offerings

12.3.3. Financial Performance

12.3.4. Recent Initiatives

12.4. Intel Corporation (United States)

12.4.1. Company Overview

12.4.2. Product Offerings

12.4.3. Financial Performance

12.4.4. Recent Initiatives

12.5. Western Digital Corporation (United States)

12.5.1. Company Overview

12.5.2. Product Offerings

12.5.3. Financial Performance

12.5.4. Recent Initiatives

12.6. Toshiba Memory Corporation (Japan)

12.6.1. Company Overview

12.6.2. Product Offerings

12.6.3. Financial Performance

12.6.4. Recent Initiatives

12.7. Fujitsu Ltd. (Japan)

12.7.1. Company Overview

12.7.2. Product Offerings

12.7.3. Financial Performance

12.7.4. Recent Initiatives

12.8. Adesto Technologies Corporation (United States)

12.8.1. Company Overview

12.8.2. Product Offerings

12.8.3. Financial Performance

12.8.4. Recent Initiatives

12.9. Crossbar Inc. (United States)

12.9.1. Company Overview

12.9.2. Product Offerings

12.9.3. Financial Performance

12.9.4. Recent Initiatives

12.10. Everspin Technologies Inc. (United States)

12.10.1. Company Overview

12.10.2. Product Offerings

12.10.3. Financial Performance

12.10.4. Recent Initiatives

Chapter 13. Research Methodology

13.1. Primary Research

13.2. Secondary Research

13.3. Assumptions

Chapter 14. Appendix

14.1. About Us

14.2. Glossary of Terms

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