The global next generation memory market size is calculated at USD 11.11 billion in 2025 and is forecasted to reach around USD 43.38 billion by 2034, accelerating at a CAGR of 16.34% from 2025 to 2034. The Asia Pacific next generation memory market size surpassed USD 5.67 billion in 2025 and is expanding at a CAGR of 16.45% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Next Generation Memory Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Next Generation Memory Market, by Technology
8.1.1 Non-volatile Memory
8.1.1.1. Market Revenue and Forecast
8.1.2. Volatile Memory
8.1.2.1. Market Revenue and Forecast
9.1. Next Generation Memory Market, by Wafer Size
9.1.1. 200 mm
9.1.1.1. Market Revenue and Forecast
9.1.2. 300 mm
9.1.2.1. Market Revenue and Forecast
10.1. Next Generation Memory Market, by Application
10.1.1. Consumer Electronics
10.1.1.1. Market Revenue and Forecast
10.1.2. Enterprise Storage
10.1.2.1. Market Revenue and Forecast
10.1.3. Automotive & Transportation
10.1.3.1. Market Revenue and Forecast
10.1.4. Military & Aerospace
10.1.4.1. Market Revenue and Forecast
10.1.5. Industrial
10.1.5.1. Market Revenue and Forecast
10.1.6. Telecommunications
10.1.6.1. Market Revenue and Forecast
10.1.7. Energy & Power
10.1.7.1. Market Revenue and Forecast
10.1.8. Healthcare
10.1.8.1. Market Revenue and Forecast
10.1.9. Agricultural
10.1.9.1. Market Revenue and Forecast
10.1.10. Retail
10.1.10.1. Market Revenue and Forecast
10.1.11. Others
10.1.11.1. Market Revenue and Forecast
11.1. North America
11.1.1. Market Revenue and Forecast, by Technology
11.1.2. Market Revenue and Forecast, by Wafer Size
11.1.3. Market Revenue and Forecast, by Application
11.1.4. U.S.
11.1.4.1. Market Revenue and Forecast, by Technology
11.1.4.2. Market Revenue and Forecast, by Wafer Size
11.1.4.3. Market Revenue and Forecast, by Application
11.1.5. Rest of North America
11.1.5.1. Market Revenue and Forecast, by Technology
11.1.5.2. Market Revenue and Forecast, by Wafer Size
11.1.5.3. Market Revenue and Forecast, by Application
11.2. Europe
11.2.1. Market Revenue and Forecast, by Technology
11.2.2. Market Revenue and Forecast, by Wafer Size
11.2.3. Market Revenue and Forecast, by Application
11.2.4. UK
11.2.4.1. Market Revenue and Forecast, by Technology
11.2.4.2. Market Revenue and Forecast, by Wafer Size
11.2.4.3. Market Revenue and Forecast, by Application
11.2.5. Germany
11.2.5.1. Market Revenue and Forecast, by Technology
11.2.5.2. Market Revenue and Forecast, by Wafer Size
11.2.5.3. Market Revenue and Forecast, by Application
11.2.6. France
11.2.6.1. Market Revenue and Forecast, by Technology
11.2.6.2. Market Revenue and Forecast, by Wafer Size
11.2.6.3. Market Revenue and Forecast, by Application
11.2.7. Rest of Europe
11.2.7.1. Market Revenue and Forecast, by Technology
11.2.7.2. Market Revenue and Forecast, by Wafer Size
11.2.7.3. Market Revenue and Forecast, by Application
11.3. APAC
11.3.1. Market Revenue and Forecast, by Technology
11.3.2. Market Revenue and Forecast, by Wafer Size
11.3.3. Market Revenue and Forecast, by Application
11.3.4. India
11.3.4.1. Market Revenue and Forecast, by Technology
11.3.4.2. Market Revenue and Forecast, by Wafer Size
11.3.4.3. Market Revenue and Forecast, by Application
11.3.5. China
11.3.5.1. Market Revenue and Forecast, by Technology
11.3.5.2. Market Revenue and Forecast, by Wafer Size
11.3.5.3. Market Revenue and Forecast, by Application
11.3.6. Japan
11.3.6.1. Market Revenue and Forecast, by Technology
11.3.6.2. Market Revenue and Forecast, by Wafer Size
11.3.6.3. Market Revenue and Forecast, by Application
11.3.7. Rest of APAC
11.3.7.1. Market Revenue and Forecast, by Technology
11.3.7.2. Market Revenue and Forecast, by Wafer Size
11.3.7.3. Market Revenue and Forecast, by Application
11.4. MEA
11.4.1. Market Revenue and Forecast, by Technology
11.4.2. Market Revenue and Forecast, by Wafer Size
11.4.3. Market Revenue and Forecast, by Application
11.4.4. GCC
11.4.4.1. Market Revenue and Forecast, by Technology
11.4.4.2. Market Revenue and Forecast, by Wafer Size
11.4.4.3. Market Revenue and Forecast, by Application
11.4.5. North Africa
11.4.5.1. Market Revenue and Forecast, by Technology
11.4.5.2. Market Revenue and Forecast, by Wafer Size
11.4.5.3. Market Revenue and Forecast, by Application
11.4.6. South Africa
11.4.6.1. Market Revenue and Forecast, by Technology
11.4.6.2. Market Revenue and Forecast, by Wafer Size
11.4.6.3. Market Revenue and Forecast, by Application
11.4.7. Rest of MEA
11.4.7.1. Market Revenue and Forecast, by Technology
11.4.7.2. Market Revenue and Forecast, by Wafer Size
11.4.7.3. Market Revenue and Forecast, by Application
11.5. Latin America
11.5.1. Market Revenue and Forecast, by Technology
11.5.2. Market Revenue and Forecast, by Wafer Size
11.5.3. Market Revenue and Forecast, by Application
11.5.4. Brazil
11.5.4.1. Market Revenue and Forecast, by Technology
11.5.4.2. Market Revenue and Forecast, by Wafer Size
11.5.4.3. Market Revenue and Forecast, by Application
11.5.5. Rest of LATAM
11.5.5.1. Market Revenue and Forecast, by Technology
11.5.5.2. Market Revenue and Forecast, by Wafer Size
11.5.5.3. Market Revenue and Forecast, by Application
12.1. Micron Technology, Inc. (United States)
12.1.1. Company Overview
12.1.2. Product Offerings
12.1.3. Financial Performance
12.1.4. Recent Initiatives
12.2. Samsung Electronics Co., Ltd. (South Korea)
12.2.1. Company Overview
12.2.2. Product Offerings
12.2.3. Financial Performance
12.2.4. Recent Initiatives
12.3. SK Hynix Inc. (South Korea)
12.3.1. Company Overview
12.3.2. Product Offerings
12.3.3. Financial Performance
12.3.4. Recent Initiatives
12.4. Intel Corporation (United States)
12.4.1. Company Overview
12.4.2. Product Offerings
12.4.3. Financial Performance
12.4.4. Recent Initiatives
12.5. Western Digital Corporation (United States)
12.5.1. Company Overview
12.5.2. Product Offerings
12.5.3. Financial Performance
12.5.4. Recent Initiatives
12.6. Toshiba Memory Corporation (Japan)
12.6.1. Company Overview
12.6.2. Product Offerings
12.6.3. Financial Performance
12.6.4. Recent Initiatives
12.7. Fujitsu Ltd. (Japan)
12.7.1. Company Overview
12.7.2. Product Offerings
12.7.3. Financial Performance
12.7.4. Recent Initiatives
12.8. Adesto Technologies Corporation (United States)
12.8.1. Company Overview
12.8.2. Product Offerings
12.8.3. Financial Performance
12.8.4. Recent Initiatives
12.9. Crossbar Inc. (United States)
12.9.1. Company Overview
12.9.2. Product Offerings
12.9.3. Financial Performance
12.9.4. Recent Initiatives
12.10. Everspin Technologies Inc. (United States)
12.10.1. Company Overview
12.10.2. Product Offerings
12.10.3. Financial Performance
12.10.4. Recent Initiatives
13.1. Primary Research
13.2. Secondary Research
13.3. Assumptions
14.1. About Us
14.2. Glossary of Terms
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