Organic Substrate Packaging Material Market (By Application: Consumer Electronics, Automotive, Manufacturing, Healthcare, Others; By Technology: SO Packages, GA Packages, Flat no-leads Packages, Others) - Global Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2024-2033
The global organic substrate packaging material market size was USD 15.27 billion in 2023, calculated at USD 15.86 billion in 2024 and is expected to reach around USD 22.26 billion by 2033, expanding at a CAGR of 3.84% from 2024 to 2033. A significant rise in the demand for portable electronic devices, in addition to the advancements in information and communication technology is the organic substrate packaging material market driver.
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The Asia Pacific organic substrate packaging material market size was valued at USD 10.38 billion in 2023 and is expected to be worth around USD 15.25 billion by 2033, at a CAGR of 3.92% from 2024 to 2033.
Asia Pacific dominated the organic substrate packaging material market in 2023. Market growth in the Asia Pacific is primarily driven by the rising adoption of smartphones, the increasing number of Internet users, and the introduction of new features and technologies that attract new customers and expand footprints in emerging markets. Also, the region's leading position in the global printed circuit board market supports the growth of organic substrate PCBs. Major global packaging substrate manufacturers are primarily located in Taiwan, South Korea, and Japan.
North America is projected to show the fastest growth in the organic substrate packaging material market over the forecast period. The rising demand for biodegradable and compostable packaging materials in the region can be attributed to the expanding food and beverage industry. Furthermore, advancements in packaging technology, including flat no-lead packages, quad-flat packages (QFP), dual in-line packages (DIP), small outline (SO) packages, and grid arrays (GA) packages, have further driven market growth in the region.
Organic substrate packaging materials are used as the base layer for printed circuit boards (PCBs) to ensure high reliability and excellent electrical performance. These materials reduce the weight of PCBs, enhance their functionality, and improve dimensional control. They also help to minimize the environmental impact compared to inorganic alternatives. As a result, the global demand for organic substrate packaging materials is rising. China, the world's largest smartphone market, is expected to continue seeing high smartphone sales, particularly from domestic companies like OPPO and VIVO, which benefit from significant cost advantages over international competitors.
Report Coverage | Details |
Market Size by 2033 | USD 22.26 Billion |
Market Size in 2023 | USD 15.27 Billion |
Market Size in 2024 | USD 15.86 Billion |
Market Growth Rate from 2024 to 2033 | CAGR of 3.84% |
Largest Market | Asia Pacific |
Base Year | 2023 |
Forecast Period | 2024 to 2033 |
Segments Covered | Application, Technology, and Regions |
Regions Covered | North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa |
Rising demand for sustainability
Governments and regulatory bodies worldwide are implementing stricter regulations and policies to reduce plastic waste and promote sustainable packaging. These regulations support the adoption of the organic substrate packaging material market. Increasing environmental awareness among consumers is driving demand for sustainable products, including packaging materials. Consumers are more inclined to choose products with eco-friendly packaging, creating a market for organic substrates. Organic substrate packaging materials, such as those made from plant-based fibers, are biodegradable and compostable. This reduces environmental pollution and waste accumulation, addressing the growing concern over plastic pollution.
Advancements in electronic packaging technologies
The organic substrate packaging material market is growing significantly due to advancements in electronic packaging technologies and the increasing demand for compact, lightweight electronic devices. Materials like fiberglass-reinforced epoxy laminate (FR4) and polyimide are becoming popular for their excellent electrical insulation and mechanical strength. Moreover, the trend toward miniaturization in consumer electronics and the automotive sector can drive market expansion soon.
Complexity of the manufacturing process
The organic substrate packaging material market growth is limited by challenges such as the high costs of advanced organic substrates and the complexity of manufacturing processes. Additionally, stringent regulatory requirements regarding material safety and environmental impact can create further obstacles for market players. However, the ongoing research and development efforts aimed at improving substrate performance and reducing production costs can impact the market positively.
Rising government initiatives
Governments worldwide are increasingly implementing stricter environmental regulations to reduce plastic waste and promotes the organic substrate packaging material market. This creates a favorable environment for organic substrate packaging materials, which are biodegradable and eco-friendly, as businesses seek alternatives to comply with these regulations.
Many governments offer financial incentives, subsidies, and grants to companies that develop and use sustainable packaging materials. These incentives lower the cost barrier for businesses to transition to organic substrates, boosting demand and innovation in the market. Government agencies and departments are increasingly adopting green procurement policies, requiring suppliers to use sustainable packaging materials. These policies create a direct organic substrate packaging material market within the public sector and set a precedent for private companies to follow.
The consumer electronics segment dominated the organic substrate packaging material market in 2023. Factors driving growth in the consumer electronics segment, an important market for semiconductors, include the rising adoption of wearable and smart products, the expanded smartphone market, and the increasing prevalence of consumer IoT devices used in applications such as home monitoring. Furthermore, Chip manufacturers anticipate significant global popularity of high silicon 5G smartphones in the forecast period, which can potentially improve the organic substrate packaging material market.
TOP 10 ELECTRONICS MANUFACTURERS BY COUNTRY IN 2022-2023 IN USD BILLION)
Country | Value ($B) |
China | 1,368 |
Taiwan | 507 |
South Korea | 321 |
Vietnam | 213 |
Malaysia | 190 |
Japan | 170 |
United States | 166 |
Germany | 151 |
Mexico | 150 |
Thailand | 114 |
The automotive segment is expected to grow at the highest CAGR in the organic substrate packaging material market during the forecast period. Automotive electronics generate significant amounts of heat. Organic substrates, particularly those with high thermal conductivity, are crucial for effective thermal management, ensuring the longevity and reliability of electronic components under the harsh conditions often found in automotive environments.
The SO packages segment held a significant share of the organic substrate packaging material market in 2023. By integrating multiple functions into a single package, SO packages can reduce the overall cost of assembly and testing. This cost efficiency makes them attractive for high-volume consumer electronics and other applications where cost competitiveness is crucial. SO packages enable the integration of multiple electronic components, such as processors, memory chips, and passive components, into a single package. This integration supports the trend towards miniaturization in electronic devices, which is critical for applications like smartphones, wearables, and IoT devices.
Segments Covered in the Report
By Application
By Technology
By Geography
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology (Premium Insights)
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Organic Substrate Packaging Material Market
5.1. COVID-19 Landscape: Organic Substrate Packaging Material Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Organic Substrate Packaging Material Market, By Application
8.1. Organic Substrate Packaging Material Market Revenue and Volume, by Application, 2024-2033
8.1.1. Consumer Electronics
8.1.1.1. Market Revenue and Volume Forecast (2021-2033)
8.1.2. Automotive
8.1.2.1. Market Revenue and Volume Forecast (2021-2033)
8.1.3. Manufacturing
8.1.3.1. Market Revenue and Volume Forecast (2021-2033)
8.1.4. Healthcare
8.1.4.1. Market Revenue and Volume Forecast (2021-2033)
8.1.5. Others
8.1.5.1. Market Revenue and Volume Forecast (2021-2033)
Chapter 9. Global Organic Substrate Packaging Material Market, By Technology
9.1. Organic Substrate Packaging Material Market Revenue and Volume, by Technology, 2024-2033
9.1.1. SO packages
9.1.1.1. Market Revenue and Volume Forecast (2021-2033)
9.1.2. GA packages
9.1.2.1. Market Revenue and Volume Forecast (2021-2033)
9.1.3. Flat no-leads packages
9.1.3.1. Market Revenue and Volume Forecast (2021-2033)
9.1.4. Flat no-leads packages
9.1.4.1. Market Revenue and Volume Forecast (2021-2033)
Chapter 10. Global Organic Substrate Packaging Material Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.1.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.1.3. U.S.
10.1.3.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.1.3.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.1.4.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.2. Europe
10.2.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.2.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.2.3. UK
10.2.3.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.2.3.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.2.4. Germany
10.2.4.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.2.4.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.2.5. France
10.2.5.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.2.5.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.2.6.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.3. APAC
10.3.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.3.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.3.3. India
10.3.3.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.3.3.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.3.4. China
10.3.4.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.3.4.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.3.5. Japan
10.3.5.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.3.5.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.3.6.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.4. MEA
10.4.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.4.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.4.3. GCC
10.4.3.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.4.3.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.4.4. North Africa
10.4.4.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.4.4.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.4.5. South Africa
10.4.5.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.4.5.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.4.6.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.5. Latin America
10.5.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.5.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.5.3. Brazil
10.5.3.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.5.3.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Volume Forecast, by Application (2021-2033)
10.5.4.2. Market Revenue and Volume Forecast, by Technology (2021-2033)
Chapter 11. Company Profiles
11.1. Amkor Technology Inc.
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. ASE Kaohsiung (Advanced Semiconductor Engineering Inc.)
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. Compass Technology Co. Ltd.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. Hitachi Chemical Company Ltd. (Hitachi and Showa Denko)
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. Kyocera Corporation
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. Mitsubishi Corporation
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. NGK Spark Plug Co. Ltd.
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. Shinko Electric Industries Co. Ltd. (Fujitsu)
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.)
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. WUS Printed Circuit Co. Ltd.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
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