Thermal Jumpers Market Size, Share, and Trends 2024 to 2034

The global thermal jumpers market size is calculated at USD 10,29,176.20 thousand in 2025 and is forecasted to reach around USD 20,12,537.70 thousand by 2034, accelerating at a CAGR of 7.74% from 2025 to 2034. Asia Pacific market size surpassed USD 3,54,038.50 Thousand in 2024 and is expanding at a CAGR of 8.84% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.

  • Last Updated : April 2025
  • Report Code : 5877
  • Category : Semiconductor and Electronic

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions and Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis 

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Thermal Jumpers Market 

5.1. COVID-19 Landscape: Thermal Jumpers Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Thermal Jumpers Market, By Material Type

8.1. Thermal Jumpers Market Revenue and Volume Forecast, by Material Type

8.1.1. Aluminum Nitride 

8.1.1.1. Market Revenue and Volume Forecast 

8.1.2. Beryllium Oxide

8.1.2.1. Market Revenue and Volume Forecast 

8.1.3. Silicon Nitride 

8.1.3.1. Market Revenue and Volume Forecast 

8.1.4. Ceramic-based

8.1.4.1. Market Revenue and Volume Forecast

8.1.5. Others

8.1.5.1. Market Revenue and Volume Forecast

Chapter 9. Global Thermal Jumpers Market, By Mounting Style

9.1. Thermal Jumpers Market Revenue and Volume Forecast, by Mounting Style

9.1.1. Surface-Mount Thermal Jumpers SMD

9.1.1.1. Market Revenue and Volume Forecast

9.1.2. Through-Hole Thermal Jumpers

9.1.2.1. Market Revenue and Volume Forecast 

9.1.3. Embedded Thermal Jumpers

9.1.3.1. Market Revenue and Volume Forecast 

Chapter 10. Global Thermal Jumpers Market, By Thermal Conductivity 

10.1. Thermal Jumpers Market Revenue and Volume Forecast, by Thermal Conductivity

10.1.1. Standard Thermal Jumpers 

10.1.1.1. Market Revenue and Volume Forecast 

10.1.2. High-thermal conductivity Jumpers

10.1.2.1. Market Revenue and Volume Forecast 

10.1.3. Ultra-High Thermal Conductivity Jumpers

10.1.3.1. Market Revenue and Volume Forecast 

Chapter 11. Global Thermal Jumpers Market, By Application 

11.1. Thermal Jumpers Market Revenue and Volume Forecast, by Application

11.1.1. Power Electronics

11.1.1.1. Market Revenue and Volume Forecast

11.1.2. LED Lighting Systems

11.1.2.1. Market Revenue and Volume Forecast

11.1.3. RF and Microwave Components

11.1.3.1. Market Revenue and Volume Forecast

11.1.4. Automotive Electronics

11.1.4.1. Market Revenue and Volume Forecast

11.1.5. 5G and Telecom Infrastructure

11.1.5.1. Market Revenue and Volume Forecast

11.1.6. Others (Medical Devices, etc.)

11.1.6.1. Market Revenue and Volume Forecast

Chapter 12. Global Thermal Jumpers Market, Regional Estimates and Trend Forecast

12.1. North America

12.1.1. Market Revenue and Volume Forecast, by Material Type 

12.1.2. Market Revenue and Volume Forecast, by Mounting Style 

12.1.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.1.4. Market Revenue and Volume Forecast, by Application 

12.1.5. U.S.

12.1.5.1. Market Revenue and Volume Forecast, by Material Type 

12.1.5.2. Market Revenue and Volume Forecast, by Mounting Style

12.1.5.3. Market Revenue and Volume Forecast, by Thermal Conductivity

12.1.5.4. Market Revenue and Volume Forecast, by Application

12.1.6. Rest of North America

12.1.6.1. Market Revenue and Volume Forecast, by Material Type

12.1.6.2. Market Revenue and Volume Forecast, by Mounting Style 

12.1.6.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.1.6.4. Market Revenue and Volume Forecast, by Application 

12.2. Europe

12.2.1. Market Revenue and Volume Forecast, by Material Type 

12.2.2. Market Revenue and Volume Forecast, by Mounting Style 

12.2.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.2.4. Market Revenue and Volume Forecast, by Application

12.2.5. UK

12.2.5.1. Market Revenue and Volume Forecast, by Material Type 

12.2.5.2. Market Revenue and Volume Forecast, by Mounting Style 

12.2.5.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.2.5.4. Market Revenue and Volume Forecast, by Application 

12.2.6. Germany

12.2.6.1. Market Revenue and Volume Forecast, by Material Type 

12.2.6.2. Market Revenue and Volume Forecast, by Mounting Style

12.2.6.3. Market Revenue and Volume Forecast, by Thermal Conductivity

12.2.6.4. Market Revenue and Volume Forecast, by Application 

12.2.7. France

12.2.7.1. Market Revenue and Volume Forecast, by Material Type 

12.2.7.2. Market Revenue and Volume Forecast, by Mounting Style 

12.2.7.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.2.7.4. Market Revenue and Volume Forecast, by Application 

12.2.8. Rest of Europe

12.2.8.1. Market Revenue and Volume Forecast, by Material Type

12.2.8.2. Market Revenue and Volume Forecast, by Mounting Style 

12.2.8.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.2.8.4. Market Revenue and Volume Forecast, by Application 

12.3. APAC

12.3.1. Market Revenue and Volume Forecast, by Material Type 

12.3.2. Market Revenue and Volume Forecast, by Mounting Style 

12.3.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.3.4. Market Revenue and Volume Forecast, by Application 

12.3.5. India

12.3.5.1. Market Revenue and Volume Forecast, by Material Type 

12.3.5.2. Market Revenue and Volume Forecast, by Mounting Style 

12.3.5.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.3.5.4. Market Revenue and Volume Forecast, by Application 

12.3.6. China

12.3.6.1. Market Revenue and Volume Forecast, by Material Type 

12.3.6.2. Market Revenue and Volume Forecast, by Mounting Style 

12.3.6.3. Market Revenue and Volume Forecast, by Thermal Conductivity

12.3.6.4. Market Revenue and Volume Forecast, by Application 

12.3.7. Japan

12.3.7.1. Market Revenue and Volume Forecast, by Material Type 

12.3.7.2. Market Revenue and Volume Forecast, by Mounting Style 

12.3.7.3. Market Revenue and Volume Forecast, by Thermal Conductivity

12.3.7.4. Market Revenue and Volume Forecast, by Application 

12.3.8. Rest of APAC

12.3.8.1. Market Revenue and Volume Forecast, by Material Type 

12.3.8.2. Market Revenue and Volume Forecast, by Mounting Style 

12.3.8.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.3.8.4. Market Revenue and Volume Forecast, by Application 

12.4. MEA

12.4.1. Market Revenue and Volume Forecast, by Material Type 

12.4.2. Market Revenue and Volume Forecast, by Mounting Style

12.4.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.4.4. Market Revenue and Volume Forecast, by Application

12.4.5. GCC

12.4.5.1. Market Revenue and Volume Forecast, by Material Type 

12.4.5.2. Market Revenue and Volume Forecast, by Mounting Style 

12.4.5.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.4.5.4. Market Revenue and Volume Forecast, by Application 

12.4.6. North Africa

12.4.6.1. Market Revenue and Volume Forecast, by Material Type

12.4.6.2. Market Revenue and Volume Forecast, by Mounting Style

12.4.6.3. Market Revenue and Volume Forecast, by Thermal Conductivity

12.4.6.4. Market Revenue and Volume Forecast, by Application 

12.4.7. South Africa

12.4.7.1. Market Revenue and Volume Forecast, by Material Type

12.4.7.2. Market Revenue and Volume Forecast, by Mounting Style

12.4.7.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.4.7.4. Market Revenue and Volume Forecast, by Application 

12.4.8. Rest of MEA

12.4.8.1. Market Revenue and Volume Forecast, by Material Type 

12.4.8.2. Market Revenue and Volume Forecast, by Mounting Style 

12.4.8.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.4.8.4. Market Revenue and Volume Forecast, by Application 

12.5. Latin America

12.5.1. Market Revenue and Volume Forecast, by Material Type 

12.5.2. Market Revenue and Volume Forecast, by Mounting Style 

12.5.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.5.4. Market Revenue and Volume Forecast, by Application 

12.5.5. Brazil

12.5.5.1. Market Revenue and Volume Forecast, by Material Type 

12.5.5.2. Market Revenue and Volume Forecast, by Mounting Style 

12.5.5.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.5.5.4. Market Revenue and Volume Forecast, by Application 

12.5.6. Rest of LATAM

12.5.6.1. Market Revenue and Volume Forecast, by Material Type 

12.5.6.2. Market Revenue and Volume Forecast, by Mounting Style 

12.5.6.3. Market Revenue and Volume Forecast, by Thermal Conductivity 

12.5.6.4. Market Revenue and Volume Forecast, by Application 

Chapter 13. Company Profiles

13.1. Vishay Intertechnology

13.1.1. Company Overview

13.1.2. Product Offerings

13.1.3. Financial Performance

13.1.4. Recent Initiatives

13.2. TT Electronics

13.2.1. Company Overview

13.2.2. Product Offerings

13.2.3. Financial Performance

13.2.4. Recent Initiatives

13.3. Electrotechnik

13.3.1. Company Overview

13.3.2. Product Offerings

13.3.3. Financial Performance

13.3.4. Recent Initiatives

13.4. Lotus Microsystems ApS

13.4.1. Company Overview

13.4.2. Product Offerings

13.4.3. Financial Performance

13.4.4. Recent Initiatives

13.5. Stackpole Electronics, Inc. SEI

13.5.1. Company Overview

13.5.2. Product Offerings

13.5.3. Financial Performance

13.5.4. Recent Initiatives

13.6. WDI AG

13.6.1. Company Overview

13.6.2. Product Offerings

13.6.3. Financial Performance

13.6.4. Recent Initiatives

13.7. Delta

13.7.1. Company Overview

13.7.2. Product Offerings

13.7.3. Financial Performance

13.7.4. Recent Initiatives

13.8. 3M

13.8.1. Company Overview

13.8.2. Product Offerings

13.8.3. Financial Performance

13.8.4. Recent Initiatives

13.9. Amphenol Industrial Products Group

13.9.1. Company Overview

13.9.2. Product Offerings

13.9.3. Financial Performance

13.9.4. Recent Initiatives

13.10. Charles Industries, LLC

13.10.1. Company Overview

13.10.2. Product Offerings

13.10.3. Financial Performance

13.10.4. Recent Initiatives

Chapter 14. Research Methodology

14.1. Primary Research

14.2. Secondary Research

14.3. Assumptions

Chapter 15. Appendix

15.1. About Us

15.2. Glossary of Terms

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Frequently Asked Questions

The global thermal jumpers market size is expected to grow from USD 9,65,735.00 thousand in 2024 to USD 20,12,537.70 thousand by 2034.

The thermal jumpers market is anticipated to grow at a CAGR of 7.74% between 2025 and 2034.

The major players operating in the thermal jumpers market are Vishay Intertechnology, TT Electronics, Electrotechnik, Lotus Microsystems ApS, Stackpole Electronics, Inc. (SEI), WDI AG, Delta, 3M, Amphenol Industrial Products Group, Charles Industries, LLC, Akahane Electronics Corporation, FINECS CO. LTD., NIDEC COPAL ELECTRONICS, and Others.

The driving factors of the thermal jumpers market are the industries like aerospace, defense, and consumer electronics have witnessed an increased need for electronic cooling solutions, driving demand for thermal jumpers.

Asia Pacific region will lead the global thermal jumpers market during the forecast period 2025 to 2034.

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