The global silicon carbide semiconductor devices market size is calculated at USD 3.64 billion in 2025 and is forecasted to reach around USD 24.95 billion by 2034, accelerating at a CAGR of 23.83% from 2025 to 2034. Asia Pacific market size surpassed USD 0.91 billion in 2024 and is expanding at a CAGR of 24.06% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Silicon Carbide Semiconductor Devices Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Silicon Carbide Semiconductor Devices Market Revenue and Volume Forecast, by Component
8.1.1. Schottky Diodes
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. FET/MOSFET Transistors
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. Integrated Circuits
8.1.3.1. Market Revenue and Volume Forecast
8.1.4. Rectifiers/Diodes
8.1.4.1. Market Revenue and Volume Forecast
8.1.5. Power Modules
8.1.5.1. Market Revenue and Volume Forecast
8.1.6. Others
8.1.6.1. Market Revenue and Volume Forecast
9.1. Silicon Carbide Semiconductor Devices Market Revenue and Volume Forecast, by Product
9.1.1. Optoelectronic Devices
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. Power Semiconductors
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. Frequency Devices
9.1.3.1. Market Revenue and Volume Forecast
10.1. Silicon Carbide Semiconductor Devices Market Revenue and Volume Forecast, by Wafer Size
10.1.1. 1 inch to 4 inches
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. 6 inches
10.1.2.1. Market Revenue and Volume Forecast
10.1.3. 8 inches
10.1.3.1. Market Revenue and Volume Forecast
10.1.4. 10 inches & above
10.1.4.1. Market Revenue and Volume Forecast
11.1. Silicon Carbide Semiconductor Devices Market Revenue and Volume Forecast, by End-use
11.1.1. Automotive
11.1.1.1. Market Revenue and Volume Forecast
11.1.2. Consumer Electronics
11.1.2.1. Market Revenue and Volume Forecast
11.1.3. Aerospace & Defense
11.1.3.1. Market Revenue and Volume Forecast
11.1.4. Medical Devices
11.1.4.1. Market Revenue and Volume Forecast
11.1.5. Data & Communication Devices
11.1.5.1. Market Revenue and Volume Forecast
11.1.6. Energy & Power
11.1.6.1. Market Revenue and Volume Forecast
11.1.7. Others
11.1.7.1. Market Revenue and Volume Forecast
12.1. North America
12.1.1. Market Revenue and Volume Forecast, by Component
12.1.2. Market Revenue and Volume Forecast, by Product
12.1.3. Market Revenue and Volume Forecast, by Wafer Size
12.1.4. Market Revenue and Volume Forecast, by End-use
12.1.5. U.S.
12.1.5.1. Market Revenue and Volume Forecast, by Component
12.1.5.2. Market Revenue and Volume Forecast, by Product
12.1.5.3. Market Revenue and Volume Forecast, by Wafer Size
12.1.5.4. Market Revenue and Volume Forecast, by End-use
12.1.6. Rest of North America
12.1.6.1. Market Revenue and Volume Forecast, by Component
12.1.6.2. Market Revenue and Volume Forecast, by Product
12.1.6.3. Market Revenue and Volume Forecast, by Wafer Size
12.1.6.4. Market Revenue and Volume Forecast, by End-use
12.2. Europe
12.2.1. Market Revenue and Volume Forecast, by Component
12.2.2. Market Revenue and Volume Forecast, by Product
12.2.3. Market Revenue and Volume Forecast, by Wafer Size
12.2.4. Market Revenue and Volume Forecast, by End-use
12.2.5. UK
12.2.5.1. Market Revenue and Volume Forecast, by Component
12.2.5.2. Market Revenue and Volume Forecast, by Product
12.2.5.3. Market Revenue and Volume Forecast, by Wafer Size
12.2.5.4. Market Revenue and Volume Forecast, by End-use
12.2.6. Germany
12.2.6.1. Market Revenue and Volume Forecast, by Component
12.2.6.2. Market Revenue and Volume Forecast, by Product
12.2.6.3. Market Revenue and Volume Forecast, by Wafer Size
12.2.6.4. Market Revenue and Volume Forecast, by End-use
12.2.7. France
12.2.7.1. Market Revenue and Volume Forecast, by Component
12.2.7.2. Market Revenue and Volume Forecast, by Product
12.2.7.3. Market Revenue and Volume Forecast, by Wafer Size
12.2.7.4. Market Revenue and Volume Forecast, by End-use
12.2.8. Rest of Europe
12.2.8.1. Market Revenue and Volume Forecast, by Component
12.2.8.2. Market Revenue and Volume Forecast, by Product
12.2.8.3. Market Revenue and Volume Forecast, by Wafer Size
12.2.8.4. Market Revenue and Volume Forecast, by End-use
12.3. APAC
12.3.1. Market Revenue and Volume Forecast, by Component
12.3.2. Market Revenue and Volume Forecast, by Product
12.3.3. Market Revenue and Volume Forecast, by Wafer Size
12.3.4. Market Revenue and Volume Forecast, by End-use
12.3.5. India
12.3.5.1. Market Revenue and Volume Forecast, by Component
12.3.5.2. Market Revenue and Volume Forecast, by Product
12.3.5.3. Market Revenue and Volume Forecast, by Wafer Size
12.3.5.4. Market Revenue and Volume Forecast, by End-use
12.3.6. China
12.3.6.1. Market Revenue and Volume Forecast, by Component
12.3.6.2. Market Revenue and Volume Forecast, by Product
12.3.6.3. Market Revenue and Volume Forecast, by Wafer Size
12.3.6.4. Market Revenue and Volume Forecast, by End-use
12.3.7. Japan
12.3.7.1. Market Revenue and Volume Forecast, by Component
12.3.7.2. Market Revenue and Volume Forecast, by Product
12.3.7.3. Market Revenue and Volume Forecast, by Wafer Size
12.3.7.4. Market Revenue and Volume Forecast, by End-use
12.3.8. Rest of APAC
12.3.8.1. Market Revenue and Volume Forecast, by Component
12.3.8.2. Market Revenue and Volume Forecast, by Product
12.3.8.3. Market Revenue and Volume Forecast, by Wafer Size
12.3.8.4. Market Revenue and Volume Forecast, by End-use
12.4. MEA
12.4.1. Market Revenue and Volume Forecast, by Component
12.4.2. Market Revenue and Volume Forecast, by Product
12.4.3. Market Revenue and Volume Forecast, by Wafer Size
12.4.4. Market Revenue and Volume Forecast, by End-use
12.4.5. GCC
12.4.5.1. Market Revenue and Volume Forecast, by Component
12.4.5.2. Market Revenue and Volume Forecast, by Product
12.4.5.3. Market Revenue and Volume Forecast, by Wafer Size
12.4.5.4. Market Revenue and Volume Forecast, by End-use
12.4.6. North Africa
12.4.6.1. Market Revenue and Volume Forecast, by Component
12.4.6.2. Market Revenue and Volume Forecast, by Product
12.4.6.3. Market Revenue and Volume Forecast, by Wafer Size
12.4.6.4. Market Revenue and Volume Forecast, by End-use
12.4.7. South Africa
12.4.7.1. Market Revenue and Volume Forecast, by Component
12.4.7.2. Market Revenue and Volume Forecast, by Product
12.4.7.3. Market Revenue and Volume Forecast, by Wafer Size
12.4.7.4. Market Revenue and Volume Forecast, by End-use
12.4.8. Rest of MEA
12.4.8.1. Market Revenue and Volume Forecast, by Component
12.4.8.2. Market Revenue and Volume Forecast, by Product
12.4.8.3. Market Revenue and Volume Forecast, by Wafer Size
12.4.8.4. Market Revenue and Volume Forecast, by End-use
12.5. Latin America
12.5.1. Market Revenue and Volume Forecast, by Component
12.5.2. Market Revenue and Volume Forecast, by Product
12.5.3. Market Revenue and Volume Forecast, by Wafer Size
12.5.4. Market Revenue and Volume Forecast, by End-use
12.5.5. Brazil
12.5.5.1. Market Revenue and Volume Forecast, by Component
12.5.5.2. Market Revenue and Volume Forecast, by Product
12.5.5.3. Market Revenue and Volume Forecast, by Wafer Size
12.5.5.4. Market Revenue and Volume Forecast, by End-use
12.5.6. Rest of LATAM
12.5.6.1. Market Revenue and Volume Forecast, by Component
12.5.6.2. Market Revenue and Volume Forecast, by Product
12.5.6.3. Market Revenue and Volume Forecast, by Wafer Size
12.5.6.4. Market Revenue and Volume Forecast, by End-use
13.1. ALLEGRO MICROSYSTEMS, INC.
13.1.1. Company Overview
13.1.2. Product Offerings
13.1.3. Financial PerComponentance
13.1.4. Recent Initiatives
13.2. Infineon Technologies AG
13.2.1. Company Overview
13.2.2. Product Offerings
13.2.3. Financial PerComponentance
13.2.4. Recent Initiatives
13.3. ROHM Co., Ltd.
13.3.1. Company Overview
13.3.2. Product Offerings
13.3.3. Financial PerComponentance
13.3.4. Recent Initiatives
13.4. STMicroelectronics N.V.
13.4.1. Company Overview
13.4.2. Product Offerings
13.4.3. Financial PerComponentance
13.4.4. Recent Initiatives
13.5. ON SEMICONDUCTOR CORPORATION (on semi)
13.5.1. Company Overview
13.5.2. Product Offerings
13.5.3. Financial PerComponentance
13.5.4. Recent Initiatives
13.6. WOLFSPEED, INC.
13.6.1. Company Overview
13.6.2. Product Offerings
13.6.3. Financial PerComponentance
13.6.4. Recent Initiatives
13.7. Gene Sic Semiconductor
13.7.1. Company Overview
13.7.2. Product Offerings
13.7.3. Financial PerComponentance
13.7.4. Recent Initiatives
13.8. TT Electronics plc.
13.8.1. Company Overview
13.8.2. Product Offerings
13.8.3. Financial PerComponentance
13.8.4. Recent Initiatives
13.9. Mitsubishi Electric Corporation
13.9.1. Company Overview
13.9.2. Product Offerings
13.9.3. Financial PerComponentance
13.9.4. Recent Initiatives
13.10. Powerex Inc.
13.10.1. Company Overview
13.10.2. Product Offerings
13.10.3. Financial PerComponentance
13.10.4. Recent Initiatives
14.1. Primary Research
14.2. Secondary Research
14.3. Assumptions
15.1. About Us
15.2. Glossary of Terms
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