The global 3D IC and 2.5D IC packaging market size is calculated at USD 66.96 billion in 2025 and is forecasted to reach around USD 167.57 billion by 2034, accelerating at a CAGR of 10.73% from 2025 to 2034. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: 3D IC and 2.5D IC Packaging Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. 3D IC and 2.5D IC Packaging Market Revenue and Volume, by Packaging Technology
8.1.1 3D Wafer-Level Chip-Scale Packaging (WLCSP)
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. 3D Through-Silicon Via (TSV)
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. 2.5D
8.1.3.1. Market Revenue and Volume Forecast
9.1. 3D IC and 2.5D IC Packaging Market Revenue and Volume, by Application
9.1.1. MEMS/Sensors
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. Logic
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. Imaging & Optoelectronics
9.1.3.1. Market Revenue and Volume Forecast
9.1.4. Memory
9.1.4.1. Market Revenue and Volume Forecast
9.1.5. LED
9.1.5.1. Market Revenue and Volume Forecast
9.1.6. Others
9.1.6.1. Market Revenue and Volume Forecast
10.1. 3D IC and 2.5D IC Packaging Market Revenue and Volume, by End Use
10.1.1. Consumer Electronics
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. Industrial
10.1.2.1. Market Revenue and Volume Forecast
10.1.3. Telecommunications
10.1.3.1. Market Revenue and Volume Forecast
10.1.4. Automotive
10.1.4.1. Market Revenue and Volume Forecast
10.1.5. Military & Aerospace
10.1.5.1. Market Revenue and Volume Forecast
10.1.6. Medical Devices
10.1.6.1. Market Revenue and Volume Forecast
11.1. North America
11.1.1. Market Revenue and Volume Forecast, by Packaging Technology
11.1.2. Market Revenue and Volume Forecast, by Application
11.1.3. Market Revenue and Volume Forecast, by End Use
11.1.4. U.S.
11.1.4.1. Market Revenue and Volume Forecast, by Packaging Technology
11.1.4.2. Market Revenue and Volume Forecast, by Application
11.1.4.3. Market Revenue and Volume Forecast, by End Use
11.1.5. Rest of North America
11.1.5.1. Market Revenue and Volume Forecast, by Packaging Technology
11.1.5.2. Market Revenue and Volume Forecast, by Application
11.1.5.3. Market Revenue and Volume Forecast, by End Use
11.2. Europe
11.2.1. Market Revenue and Volume Forecast, by Packaging Technology
11.2.2. Market Revenue and Volume Forecast, by Application
11.2.3. Market Revenue and Volume Forecast, by End Use
11.2.4. UK
11.2.4.1. Market Revenue and Volume Forecast, by Packaging Technology
11.2.4.2. Market Revenue and Volume Forecast, by Application
11.2.4.3. Market Revenue and Volume Forecast, by End Use
11.2.5. Germany
11.2.5.1. Market Revenue and Volume Forecast, by Packaging Technology
11.2.5.2. Market Revenue and Volume Forecast, by Application
11.2.5.3. Market Revenue and Volume Forecast, by End Use
11.2.6. France
11.2.6.1. Market Revenue and Volume Forecast, by Packaging Technology
11.2.6.2. Market Revenue and Volume Forecast, by Application
11.2.6.3. Market Revenue and Volume Forecast, by End Use
11.2.7. Rest of Europe
11.2.7.1. Market Revenue and Volume Forecast, by Packaging Technology
11.2.7.2. Market Revenue and Volume Forecast, by Application
11.2.7.3. Market Revenue and Volume Forecast, by End Use
11.3. APAC
11.3.1. Market Revenue and Volume Forecast, by Packaging Technology
11.3.2. Market Revenue and Volume Forecast, by Application
11.3.3. Market Revenue and Volume Forecast, by End Use
11.3.4. India
11.3.4.1. Market Revenue and Volume Forecast, by Packaging Technology
11.3.4.2. Market Revenue and Volume Forecast, by Application
11.3.4.3. Market Revenue and Volume Forecast, by End Use
11.3.5. China
11.3.5.1. Market Revenue and Volume Forecast, by Packaging Technology
11.3.5.2. Market Revenue and Volume Forecast, by Application
11.3.5.3. Market Revenue and Volume Forecast, by End Use
11.3.6. Japan
11.3.6.1. Market Revenue and Volume Forecast, by Packaging Technology
11.3.6.2. Market Revenue and Volume Forecast, by Application
11.3.6.3. Market Revenue and Volume Forecast, by End Use
11.3.7. Rest of APAC
11.3.7.1. Market Revenue and Volume Forecast, by Packaging Technology
11.3.7.2. Market Revenue and Volume Forecast, by Application
11.3.7.3. Market Revenue and Volume Forecast, by End Use
11.4. MEA
11.4.1. Market Revenue and Volume Forecast, by Packaging Technology
11.4.2. Market Revenue and Volume Forecast, by Application
11.4.3. Market Revenue and Volume Forecast, by End Use
11.4.4. GCC
11.4.4.1. Market Revenue and Volume Forecast, by Packaging Technology
11.4.4.2. Market Revenue and Volume Forecast, by Application
11.4.4.3. Market Revenue and Volume Forecast, by End Use
11.4.5. North Africa
11.4.5.1. Market Revenue and Volume Forecast, by Packaging Technology
11.4.5.2. Market Revenue and Volume Forecast, by Application
11.4.5.3. Market Revenue and Volume Forecast, by End Use
11.4.6. South Africa
11.4.6.1. Market Revenue and Volume Forecast, by Packaging Technology
11.4.6.2. Market Revenue and Volume Forecast, by Application
11.4.6.3. Market Revenue and Volume Forecast, by End Use
11.4.7. Rest of MEA
11.4.7.1. Market Revenue and Volume Forecast, by Packaging Technology
11.4.7.2. Market Revenue and Volume Forecast, by Application
11.4.7.3. Market Revenue and Volume Forecast, by End Use
11.5. Latin America
11.5.1. Market Revenue and Volume Forecast, by Packaging Technology
11.5.2. Market Revenue and Volume Forecast, by Application
11.5.3. Market Revenue and Volume Forecast, by End Use
11.5.4. Brazil
11.5.4.1. Market Revenue and Volume Forecast, by Packaging Technology
11.5.4.2. Market Revenue and Volume Forecast, by Application
11.5.4.3. Market Revenue and Volume Forecast, by End Use
11.5.5. Rest of LATAM
11.5.5.1. Market Revenue and Volume Forecast, by Packaging Technology
11.5.5.2. Market Revenue and Volume Forecast, by Application
11.5.5.3. Market Revenue and Volume Forecast, by End Use
12.1. Samsung
12.1.1. Company Overview
12.1.2. Product Offerings
12.1.3. Financial Performance
12.1.4. Recent Initiatives
12.2. Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
12.2.1. Company Overview
12.2.2. Product Offerings
12.2.3. Financial Performance
12.2.4. Recent Initiatives
12.3. Intel Corporation
12.3.1. Company Overview
12.3.2. Product Offerings
12.3.3. Financial Performance
12.3.4. Recent Initiatives
12.4. ASE Technology Holding Co., Ltd.
12.4.1. Company Overview
12.4.2. Product Offerings
12.4.3. Financial Performance
12.4.4. Recent Initiatives
12.5. Amkor Technology
12.5.1. Company Overview
12.5.2. Product Offerings
12.5.3. Financial Performance
12.5.4. Recent Initiatives
12.6. Broadcom
12.6.1. Company Overview
12.6.2. Product Offerings
12.6.3. Financial Performance
12.6.4. Recent Initiatives
12.7. Texas Instruments Inc.
12.7.1. Company Overview
12.7.2. Product Offerings
12.7.3. Financial Performance
12.7.4. Recent Initiatives
12.8. United Microelectronics Corporation (UMC)
12.8.1. Company Overview
12.8.2. Product Offerings
12.8.3. Financial Performance
12.8.4. Recent Initiatives
12.9. JCET Group Co., Ltd.
12.9.1. Company Overview
12.9.2. Product Offerings
12.9.3. Financial Performance
12.9.4. Recent Initiatives
12.10. Powertech Technology Inc.
12.10.1. Company Overview
12.10.2. Product Offerings
12.10.3. Financial Performance
12.10.4. Recent Initiatives
13.1. Primary Research
13.2. Secondary Research
13.3. Assumptions
14.1. About Us
14.2. Glossary of Terms
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