Passive and Interconnecting Electronic Components Market Size, Share, and Trends 2025 to 2034

The global passive and interconnecting electronic components market size is calculated at USD 206.06 billion in 2025 and is forecasted to reach around USD 331.26 billion by 2034, accelerating at a CAGR of 5.38% from 2025 to 2034. The Asia Pacific passive and interconnecting electronic components market size surpassed USD 98.91 billion in 2025 and is expanding at a CAGR of 5.49% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.

  • Last Updated : 15 Jan 2025
  • Report Code : 1372
  • Category : Semiconductor and Electronic

Passive and Interconnecting Electronic Components Market Size and Forecast 2025 to 2034

The global passive and interconnecting electronic components market size was accounted for USD 196.06 billion in 2024 and is anticipated to reach around USD 331.26 billion by 2034, growing at a CAGR of 5.38% from 2025 to 2034. The increasing industrial automation and use of control systems like robots and computers which help the growth of the passive and interconnecting electronic components market.

Passive and Interconnecting Electronic Components Market Size 2025 to 2034

Passive and Interconnecting Electronic Components Market Key Takeaways

  • Asia Pacific dominated the global passive and interconnecting electronic components market with the largest market share of 48% in 2024.
  • China is expected to expand at a solid CAGR of 5.08% during the forecast period. 
  • By component, the interconnecting segment contributed the highest market share of 48% in 2024.
  • By component, the passive segment is projected to grow at a notable CAGR during the forecast period.
  • By application, the consumer electronics segment accounted for the highest market share of 36% in 2024.
  • By application, the automotive segment is expected to grow at a healthy CAGR during the forecast period.

How is AI changing Passive and Interconnecting Electronic Components?

Artificial intelligence (AI) can transform the passive and interconnect design. Applications of AI in these components include handling large datasets and, the need for multiple distributed GPUs, and CPUs communicating in real-time. AI in electronics is used to improve device functionality and user experience, allowing features like facial and voice recognition, predictive maintenance, and effective energy management across a range of devices from smartphones to industrial machinery. AI is used in the electronic industry which makes easier and faster product development to enhance quality and strengthen supply chains which helps the growth of the passive and interconnecting electronic components market.

Asia Pacific Passive and Interconnecting Electronic Components Market Size and Growth 2025 to 2034

The Asia Pacific passive and interconnecting electronic components market size was evaluated at USD 9.11 billion in 2024 and is predicted to be worth around USD 160.66 billion by 2034, rising at a CAGR of 5.49% from 2025 to 2034. 

Asia Pacific Passive and Interconnecting Electronic Components Market Size 2025 To 2034

Due to the presence of major market players in the region such as Samsung Electronics Co., Ltd., BBK electronics (Includes brands such as Oppo, Realme, and Vivo), Foxconn Technology Group, and Xiaomi Corporation, Asia Pacific dominated the Passive and Interconne. citing Electronic Components Market, contributing a revenue share of more than USD 97.1 billion in 2020. China dominates the passive and interconnecting electronic components market in this region and is the major exporter of electronics products across the world. For instance, In 2018,

Passive and Interconnecting Electronic Components Market Share, By Region, 2024 (%)

In North America, the soaring demand for connected cars in the U.S. is leading the telecom giants such as Verizon Inc.; and AT&T Inc., to invest heavily in deploying 5G network infrastructure. The 5G mobile network is estimated to provide unified connectivity to vehicles with infrastructures across the country. Also, the U.S. government is spending heavily on building smart cities countrywide. In the future years, the high demand for 5G networks would need the implementation of 5G network infrastructure, which will propel the industry forward. For instance, On 23rd September 2021, KYOCERA AVX Components Corporation, a leading manufacturer and supplier of sophisticated electronic components and connector, sensor, control, and antenna systems, has introduced a new series of external, dual-band Wi-Fi antennas that are optimized for 2.4GHz and 5GHz applications and are IP67-rated. The new X9001748 Series external, dual-band Wi-Fi antennas have a standardized, ready-to-use, RoHS-compliant design with IP67 sealing for reliable outdoor operation, and provide high-gain, high-efficiency, and high-reliability performance in a variety of device configurations and frequencies spanning 2,400–2,485MHz and 5,150–5,850MHz.

Passive and Interconnecting Electronic Components Market Growth Factors

  • Electronic equipment such as cellphones, computers, electrical home appliances, and gaming consoles make use of passive and interconnected electronic components. As a result, the surge in demand for smartphones, laptops, gaming consoles, and household appliances is likely to be the primary driver of market growth.
  • The infrastructure for 5G networks is being rapidly built in key countries such as the United States, China, South Korea, Japan, and the United Kingdom. 
  • The impending 5G services, together with a growing demand for high-speed internet connectivity among customers, have fueled global demand for 5G devices. 
  • The surge in demand for 5G devices across a variety of industries, including industrial, automotive, and consumer electronics, is expected to drive the market for passive and linking electrical components.

Market Scope

Report Highlights Details
Market Size in 2025 USD 206.06 Billion
Market Size by 2034 USD 331.26 Billion
Growth Rate From 2025 to 2034 CAGR of 5.40% 
Largest Market Asia Pacific
Base Year 2024
Forecast Period 2025 to 2034
Segments Covered Component, Application
Regional Scope

North America, Europe, Asia Pacific, LAMEA

Opportunity

The industrial sector is quickly changing as a result of the widespread adoption of Internet of Things (IoT) devices. By providing simplicity of operation and reducing total system downtime, industrial IoT devices assist manufacturing facilities in increasing overall productivity and operational efficiency. In addition, as part of the fourth industrial revolution (Industrial 4.0), numerous manufacturing facilities are installing a variety of connected devices to improve operational operations via remote monitoring. As a result, the market is likely to grow faster as IoT devices are deployed across a wide range of industrial applications, such as process automation and motion control.

Component Insights

The interconnecting segment contributed the highest market share of 48% in 2024 and it is also considered to grow significantly during the forecast period. It's due to the increased demand for various types of capacitors in consumer electronic devices, industrial applications, and other uses.

Passive and Interconnecting Electronic Components Market Share, By Component, 2024 (%)

The transformer product segment is also expected to grow significantly during the forecast period owing to the vital role of the transformer in an electronic device by stepping down the high voltage to the required voltage for the circuit. As a result of the increased manufacturing of various types of household appliances, industrial digital devices, and other consumer electronic items, transformer demand is expected to skyrocket.

The interconnecting segment includes printed circuit boards (PCB), connectors/sockets, switches, relays, and others. Additionally, the surge in demand for networking and storage devices in data centers is further anticipated to boost the market growth.

Application Insights

The consumer electronics segment accounted for the highest market share of 36% in 2024. It's owing to a surge in demand for passive and linking components for a variety of consumer gadgets, including wearables, smartphones, set-top boxes (STBs), and household appliances.In addition, demand for security cameras, sensor-based devices, and robotics is fast rising across a wide range of industrial applications, including process automation and remote monitoring. And it is projected that these characteristics will propel the market forward.

The increased demand for networking devices such as modems, gateways, and repeaters is likely to drive market expansion in the office automation and residential application segments. Furthermore, 5G telecom infrastructure development is accelerating, and telecom operators are substantially spending in order to give higher bandwidth experiences to their consumers, which is expected to stimulate the growth of the IT and telecommunication application market. Furthermore, the market is expected to increase due to strong demand for infotainment systems, driver assistance systems, Global Positioning Systems (GPS), and other electronic systems for automotive applications.

Passive and Interconnecting Electronic Components Market Companies

  • AVX Corporation; Vishay Intertechnology, Inc.
  • Mouser Electronics, Inc.
  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Taiyo Yuden Co., Ltd.
  • Samsung Electro-Mechanics
  • Hosiden Corporation.
  • Yageo Corporation
  • Nichicon Corporation
  • Panasonic Corporation
  • Fujitsu Component Limited
  • Fenghua (HK) Electronics Ltd.;
  • Rohm Co., Ltd.;
  • United Chemi-Con
  • TE connectivity;
  • Molex Incorporated.

Recent Developments

  • In October 2024, a new silicone capacitor production line was launched by Murata Manufacturing Co., Ltd. 
  • In February 2024, the introduction of a new MHQ1005075HA series of inductors for automotive high-frequency circuits was announced by TDK Corporation.

Instances to support opportunity

  • In November 2024, India’s electronic manufacturing sector’s first supercapacitor production facility a major leap in electronics manufacturing was launched by Keltron at Keltron Component Complex Limited (KCCL) in Kannur. 

Segments Covered in the Report

By Component

  • Passive
    • Resistors
    • Capacitors
    • Inductors
    • Transformers
    • Diode
  • Interconnecting
    • PCB
    • Connectors/Sockets
    • Switches
    • Relays
    • Others

By Application

  • Consumer Electronics
    • Mobile Phones
    • Personal Computers
    • Home Appliances
    • Audio and Video Systems
    • Storage Devices
    • Others
  • IT & Telecommunication
    • Telecom Equipment
    • Networking Devices
  • Automotive
    • Driver Assistance Systems
    • Infotainment Systems
    • Others
  • Industrial
    • Mechatronics and robotics,
    • Power Electronics
    • Photo Voltaic Systems
    • Others
  • Aerospace & Defense
    • Aircraft systems
    • Military Radars
    • Others
  • Healthcare
    • Medical Imaging Equipment
    • Consumer Medical Devices
    • Others
  • Others

By Geography

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • U.K.
    • Germany
    • France
    • Russia
    • Italy
    • Spain
    • Rest of Europe
  • Asia Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

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Frequently Asked Questions

The global passive and interconnecting electronic components market size was reached at USD 196.06 billion in 2024 and is projected to hit USD 331.26 billion by 2034.

The global passive and interconnecting electronic components market is projected to grow at a CAGR of 5.38% during the forecast period 2025 to 2034.

The surge in demand for smartphones, laptops, gaming consoles, and household appliances is likely to be the primary driver of market growth.

The major players in the passive and interconnecting electronic components market are AVX Corporation; Vishay Intertechnology, Inc.; Mouser Electronics, Inc.; Murata Manufacturing Co., Ltd.; TDK Corporation; Taiyo Yuden Co., Ltd.; Samsung Electro-Mechanics; Hosiden Corporation.; Yageo Corporation; Nichicon Corporation; Panasonic Corporation; Fujitsu Component Limited; Fenghua (HK) Electronics Ltd.; Rohm Co., Ltd.; United Chemi-Con; TE connectivity; and Molex Incorporated.

Asia Pacific contributing a revenue share of more than USD 9.11 billion in 2024.

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